Conga - IC - a series Thin Mini-ITX form factor Motherboards

2019: Release of conga-IC370 based on the Intel processors Core of the 8th generation

On June 11, 2019 the congatec company announced release of the built-in versions of payments on a basis processorovintel Core of the 8th generation (the code name Whiskey Lake) for mobile applications. For June, 2019 the compact modules COM Express Type 6, 3.5-inch single board computers (single-board computer) and motherboards of a form factor Thin Mini-ITX are available. Read more here.

2016: Release of conga-IC170 with the built-in Intel processor Core of the 6th generation

conga-IC170' is the industrial motherboard of a form factor Thin Mini-ITX with the built-in Intel processor Core of the 6th generation.

On April 18, 2016 the congatec company announced release of the conga-IC170 motherboard from the U-series preset by the dual core version of SoC, the Intel processors Core of the 6th generation.

conga-IC170 (2016)

The motherboard in a form factor of Thin Mini-ITX conga-IC170 has the preset dual core version of SoC of a U-series, the Intel processors Core of the 6th generation. The line of the preset processors is provided by the processor of initial level of Intel Celeron 3995U with a frequency of 2.0 GHz.

The payment can be equipped with the Intel processors Core i3 6100U (2.3 GHz) and i5 6300U (2.4 GHz, 3 GHz in the Turbo Boost mode), up to Intel Core i7 6600 with the maximum frequency of 3.4 GHz in the Turbo Boost mode. Depending on the installed processor, the managed heat release (TDP) in the range from 15 W to 7.5 W is offered what allows to integrate a payment into the general concept of energy consumption of the created application.

Two SO-DIMM connectors maintain memory with a capacity up to 32 GB of DDR4-2133 standard which provides much broader capacity and the improved energy consumption in comparison with implementations of a subsystem of memory which are based on DDR3 standard.

The built-in graphic subsystem of Intel Gen9 supports the DirectX and OpenGL 4.4 standard for high-performance 3D tasks, and allows to display information on 3 independent screens with the resolution of 4K (3840х1260) and with a frequency of 60 Hz, using 2 DP ports ++ and 1 eDP port, in combination with a possibility of involvement of two-channel 24-bit LVDS. Hardware acceleration of video of the HEVC, VP8, VP9 and VDENC standards is supported.

There is a slot of PCIe x4 (Gen 3), as a part of a set of connectors of 1 mPCIe with support of standard M.2 which can be used for additional cards of expansions or connection of a SSD disk.

Connection of the additional periphery is possible by means of:

• 4-x USB 3.0 and 6 USB of 2.0 ports;
• 2 Gigabit Ethernet ports and the slot for SIM cards allow to use a payment for full-fledged M2M of applications;
• MIPI CSI-2 interface allows to connect to a payment inexpensive CMOS cameras directly.

For industrial application there are 2 COM ports, one of which can be configured as ccTalk, and 8 GPIO lines.

Support of the built-in Trusted Platform Module cryptoprocessor is optionally offered. For connection of hard drives 2 SATA 3.0 connectors can be used.

For connection of audio-devices the digital port and HD Audio port are intended for connection of a 5.1-channel sound.

As the operating system all current versions of Linux and Windows, including Windows 10 can be used.