"ISS of M.F. Reshetnyov" replaced chips of foreign production for the GLONASS satellites with domestic analogs

On November 15, 2016 the Angstrem company announced the beginning of the project of delivery of six types of chips for the GLONASS satellites by request of JSC Informatsionnye sputnikovye sistemy of a name of the academician M.F. Reshetnev.

Project Results

Within developmental works on creation and transfer of prototypes of "ISS of Reshetnyov" Angstrem developed six types of integrated circuits for the GLONASS satellites.

By the parameters chips do not concede to foreign analogs, the IC main property is resistance to influence of space radiation. The increasing integrated circuits (large-scale integrated circuits) are made by the individual order on the basis of the basic matrix crystals (BMC).

ISS of Reshetnyov enterprise, (2014)

In each GLONASS satellite 10 microchips from Angstrem which are involved in a management system of the navigation device will function. Products meet all modern requirements for functionality and mass-dimensional characteristics.

The number of angstremovsky chips on the satellite can increase considerably. In parallel with cooperation with "ISS of Reshetnyov", we work with a number of the enterprises of the space industry. Within the import substitution program we also developed several chips which will be involved in an aircraft equipment of the GLONASS satellites for them. Nikolay Plis, the First Deputy CEO of JSC Angstrem

As the press service of the contractor reported, Angstrem and "ISS of Reshetnyov" conducted negotiations on replacement of foreign electronic component base since 2012.