| Developers: | GS Nanotech |
| Date of the premiere of the system: | 2017/03/14 |
| Branches: | Electrical equipment and microelectronics |
| Technology: | Processors |
2020: Mastering of technology of installation of integrated circuits of Package-on-Package
In April, 2020 the development center and productions of microelectronics GS Nanotech (as a part of GS Group holding) together with the Petrozavodsk state university announced mastering of PoP technology (Package-on-Package, "body-on-body"). It is the mounting technique of integrated circuits at which one or more components are mounted the friend on the friend (so-called vertical installation).
The solution GS Nanotech allows, having saved compactness of a product, to increase the packing density of electronic components on a payment. PoP — one of assembly techniques "systems-in-body" (SiP). For April, 2020 GS Nanotech develops and in large quantities releases own SiP-microprocessors — SiPAmber S2 and SiPEmerald N2M.
On the platform GSNanotech the first model samples are already collected. On them operation modes of a production equipment are fulfilled, qualification tests are carried out. These actions will help to confirm quality of the applied processes, to fulfill influence of external factors and to estimate the potential of the new mounting technique of chips. By the end of 2020 the plant is going to make samples with working crystals of the Russian development using Flip-Chip technology.
Mastering of the Package-on-Package GS Nanotech method performs together with Petrgu within the Federal target program "Research and Development in the Priority Directions of Development of a Scientific and Technology Complex of Russia for 2014-2020" of the Ministry of Education and Science of the Russian Federation (a unique identifier of works of RFMEFI57718X0293). Further development of the project assumes use of PoP in the real products relevant for the Russian market of consumer electronics.
2017: Start in mass production of the SiP Emerald N2M microprocessor
For March 14, 2017 SiP Emerald N2M is the microprocessor for consumer electronics.
On March 14, 2017 GS Nanotech announced Development center and productions of microelectronics start in mass production of the multichip microprocessor of new generation for consumer SiP Emerald N2M electronics.
Use as a part of improved "system-in-body" of five crystals, including the central processor, increased the capacity of the electronic module. In plans of the company to produce up to 2 million chips of this type until the end of 2017.
SiP Emerald N2M is the system from the semiconductor crystals mounted on the multilayer printed board covered with a protective compound. The micromodule is developed by R&D-командой GS Nanotech in one year. Specialists of the enterprise improved technology of creation of the electronic modules SiP that helped to create more difficult and perfect product. As a part of "system-in-body" five crystals:
- central processor,
- the integrated coprocessor,
- RAM of DDR3
- two crystals flash memory.
Use of five crystals in one module simplified installation of the printed circuit board and promoted reduction of the size of end devices. About use of the upgraded central processor and bigger number of crystals "system-in-body" became more productive, in comparison with the SiP Amber S2 microprocessor.
When packaging the Wire bonding technology — unsoldering of outputs using a special wire 18 microns thick is used. Transition from a gold wire to copper reduced cost value of the device by 2.6%. SiP Emerald N2M gathers in the plastic BGA body and has 761 isolated exit.
The electronic module - the central part of digital set-top boxes General Satellite GS B531M and GS B532M. Basic functions of a chip — conversion of a TV signal, processing and preparation for an output to the TV screen or the mobile device.
 | "System-in-body" — the most effective today technology which allows to create at the same time miniature and functional electronic modules which are most protected from cracking that ensures safety of data transmission between components. It is a difficult and labor-consuming method of packaging. GS Nanotech became the Russia's first enterprise which in large quantities releases such chips for consumer electronics. Ours R&D-команда continues to improve SiP technology, expanding possibilities of devices. Services in packaging for external customers allow the enterprise to offer development of competences of specialists of GS Nanotech. Evgeny Maslennikov, CEO of GS Nanotech |  |
| The site content is translated by machine translation software powered by PROMT. The machine-translated articles are not always perfect and may contain errors in vocabulary, syntax or grammar. Read original article If you find inaccuracies or errors in the results of machine translation, please write to editor@tadviser.ru. We will make every effort to correct them as soon as possible. |