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Microelectronic Research Institute Progress the Chip for Internet of Things

Product
Developers: Progress of scientific research institute of the microelectronic equipment (Microelectronic Research Institute)
Date of the premiere of the system: 2018/11/29
Branches: Gas industry,  Metallurgical industry,  Oil industry,  Food industry,  Agriculture and fishery,  Telecommunication and communication,  Transport,  Electrical equipment and microelectronics
Technology: Internet of Things of Internet of Things (IoT),  Processors

2018: Creation of the Russian chip for IoT

On November 29, 2018 Rostec reported that Ruselectronics completed creation of the Russian chip for Internet of Things (Internet of Things, IoT). The chip of 5x5 mm in size is intended for acceptance and information transfer with the frequency range, optimal for Internet of Things, from 100 MHz to 2.5 GHz. It is a domestic chip which provides digital trunking at distance to 30 km.

The Russian chip for IoT

The device will be used in the solutions IoT for the industry, transport, communication, agriculture and in "smart" devices of household purpose. Main advantage – lack of not declared functions, so-called tabs that is key when using at strategically important enterprises and infrastructure facilities. For November, 2018 it is created and the pilot batch of products is tested.

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The electronic component base is a basic element at creation of the systems of Internet of Things. Development of the domestic chip is a necessary step for decrease in dependence on import component parts. Creation of similar devices promotes large-scale digitalization of the various sectors of the economy and creates premises for creation of "smart" products for mass market. We estimate requirement of the Russian market of the solutions IoT not less than at 1 million such devices a year.
Sergey Sakhnenko, industrial director of Rostec
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The chip is designed by the design center of microelectronic devices in Russia Microelectronic Research Institute Progress of Ruselectronics holding for serial production on domestic enterprises. Assembly of chips in the territory of Russia will allow devices to conform to requirements imposed to domestic microelectronic production of the first level.