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MPEI: Cooling system with combined coatings for microelectronics

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Developers: MPEI National Research University
Date of the premiere of the system: 2025/02/12
Branches: Electrical and Microelectronics

Main Article: Cooling Systems

2025: Introduction of Heat Exchange Channels with Combined Wall Coatings

Scientists at NRU MPEI have created heat exchange channels with combined wall coatings, which significantly increase the reliability and efficiency of cooling systems for electronics. The development is focused on application in radio engineering systems, processors and other devices with high heat density. The university announced this on February 12, 2025.

A key feature of the proposed okhlazhdayu​shchikh systems is the combination of a hydrophilic coating on the bottom wall of the working channel and a superhydrophobic coating on the top. The combined technical effect of the microchannel makes it possible to achieve a critical thermal load of up to 4 MW/m ² at a mass velocity of steam-water flow of up to 300 kg/m²·s.

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Heat exchange channels are a prime example of how scientific research leads to practical solutions that can change the approach to designing cooling systems for devices with high heat release. This opens up new prospects for creating highly reliable cooling systems, "said Nikolai Rogalev, rector of MPEI.
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