DALP (Direct Atomic Layer Technology)

History

2025: Product Release

In early March 2025, the Danish company Atlant 3D, specializing in atomic precision production technologies, announced the release of commercial direct atomic layer production (DALP) technology. This development makes it possible to create materials and devices with atomic accuracy, which significantly speeds up the production of components for microelectronics, quantum computers, sensors and space systems.

According to VentureBeat, DALP technology eliminates the need for multi-stage processes of traditional production, reducing waste by 90%. For example, complex structures for semiconductors or photon chips are formed in one step, while classical methods require dozens of operations.

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Фото: Atlant 3D sensor wafer

Atlant 3D CEO Maxim Plahotniuc noted that the technology allows researchers to create and test device prototypes in days, not months, and immediately scale them for industrial applications. According to him, the demand for the company's solutions is confirmed by interest from the markets of microelectronics, artificial intelligence, quantum computing and aerospace.

As part of the development of technology, Atlant 3D raised $15 million in an expanded round of funding for the A + series. The investment was led by West Hill Capital. The funds are aimed at strengthening technological leadership, expanding the product portfolio and global development of the startup's innovation ecosystem.

Since the previous round of funding, the company has launched a commercial Nanofabricator Lite system designed to accelerate materials research and device prototyping. The first user of the system was the University of Vermont. Atlant 3D also introduced the Nanofabricator Flow industrial multi-module prototype and partnered with more than 50 organizations, including STMicroelectronics, Sony and a number of Fortune 500 companies.^[1]

Notes