| Developers: | Progress of the Research Institute of Microelectronic Equipment (NIIMA), United Instrument-Making Corporation (MIC), TsNII cyclone |
| Date of the premiere of the system: | January 2022 |
| Last Release Date: | 2022/04/01 |
| Branches: | Electrical and microelectronics |
2022: Display Development
At the end of January 2022, it became known about the development of the first Russian microdisplays on organic electroluminescent LEDs (OLED). They were created at Rostec enterprises.
According to the press service of the state corporation, a screen measuring 15.5x12.5 mm produces an image with a resolution of 1280 x 1024 pixels and a pixel pitch of 12 microns. The device is designed for individual means of displaying information, such as virtual, augmented and mixed reality glasses VRARMR (//), photo and video cameras, as well as head and helmet video modules, thermal imaging sights and thermal imagers.
Development work and the development of mass production of OLED microdisplays were carried out by the Central Research Institute "Cyclone" of the holding "Roselektronika." Schematic solutions were developed by NIIMA "Progress," the topology is NIIME, and silicon 200-mm plates with SBIS were made by PJSC "Micron," which is part of the Element Group of Companies (a joint venture of Rostec State Corporation and AFK Sistema). Rostec also noted that the technologies for creating silicon control chips and manufacturing OLED microdisplays are patented and protected by the secret modes of the production of know-how.
 | We managed not only to master the most complex manufacturing technology, but also to achieve high quality of manufactured products. Our company is ready to produce up to 5,000 devices annually, "said Sergey Sakhnenko, General Director of the United Instrument-Making Plant. |  |
According to him, thanks to the new project, Russia entered the top five countries in the world that own technologies for creating OLED microdisplays.
Rostec explained that the production of OLED microdisplays requires compliance with increased requirements for the technological process: for example, it is necessary to observe high accuracy of processing the top stack of a silicon ultra-large integrated circuit (CBIS) and applying a multilayer OLED structure whose thickness does not exceed 100 nanometers.[1]
Notes
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