Infinix 3D Vapor Cloud Chamber (3D VCC)

Main Article: Cooling Systems

2022: 3D Vapour Cloud Chamber Announcement

On July 25, 2022, the company Infinix officially introduced coolings smartphone the 3D Vapor Cloud Chamber (3D VCC) technology. The designers managed to optimize the volume of the cooling chamber, which optimizes heat dissipation by 12.5% and has a positive effect on the performance of the smartphone. This solution reduces trottling and prevents frame rate drops and screen freezes while working with heavy applications. The technology developed by Infinix has been certified by the National Office. intellectual property China

3D Vapour Cloud Chamber

According to the company, 3D Vapor Cloud Chamber technology differs from traditional smartphone cooling methods and is a more advanced solution. Due to the special shape of the cooling chamber, Infinix engineers managed to achieve a 20% increase in the volume of liquid used and the internal space compared to standard solutions.

When the temperature in the cooling chamber increases, the liquid in it evaporates and removes excess heat. Then hot steam enters the condenser, is transformed back into liquid, and, due to a special structure, is returned to the cooling chamber due to the hot and cold air circulation system.

Thanks to the protrusion in the design of the cooling chamber, 3D VCC almost directly contacts the smartphone processor, which made it possible to optimize the thermal conductivity coefficient and the degree of heat dissipation. Compared to traditional two-dimensional designs, three-dimensional VCC reduces temperature by about three degrees, and the overall heat dissipation efficiency increases by about 12.5%.

To achieve the necessary heat dissipation parameters in the 3D VCC design, Infinix had to largely optimize the strength of the structure. As a result of numerous tests and changes, a team of Infinix engineers designed the internal three-dimensional structure as a matrix support, balancing the flatness and volume of the internal chamber.

3D Vapour Cloud Chamber

The second major task was to maintain the integrity of the wick structure in the three-dimensional chamber, as an unusual shape could lead to the formation of folds that could potentially lead to a blockage of the entire cooling system. The solution was found thanks to a comprehensive analysis of the density of the capillary structure and advanced welding methods.

Engineers also paid special attention to the position of the hole in the front of the case and the strength of its alloy, which made it possible to optimize the thermal resistance of the conductive medium. The team conducted a significant number of tests and tests before finding a suitable position.

As a result of intensive work on the three key features of the technology outlined above, Infinix was able to create a solution for liquid cooling of the smartphone - 3D Vapour Cloud Chamber.