Schwabe is preparing a project to launch the production of semiconductor wafers for microelectronics products

2022: Ready to manufacture polished wafers of 150 and 200 mm diameter

The holding company Schwabe"" of the State Corporation Rostec is ready to start organizing the production of polished silicon plates with a diameter of 150 and 200 mm. The initiative will help Russian microelectronic module manufacturers solve the problem of dependence on foreign materials. The Schwabe holding announced this on January 31, 2023.

The company "Germania" is considered as the contractor for the project. It is planned to use specialized equipment, production areas and technological groundwork in the machining of semiconductor materials. The concept was presented by specialist Daria Kolosova.

For potential Russian consumers of microcircuits, the plus will be the delivery time, the absence of imported customs declaration and, at the same time, full compliance of products with global counterparts. As of January 2023, there are enterprises in the country that are engaged not only in the processing of silicon raw materials, but also in the production of silicon wafers. However, the quality of such plates does not meet the high requirements for the production of integrated circuits. Therefore, due to the fact that the technologies for processing plates from germanium and silicon are similar, the idea of ​ ​ implementing a separate, import-substituting project arose, "said Tatyana Pavlyuk, General Director of the GERMANIY enterprise.

Earlier, the Microelectronics-2022 profile forum raised issues of developing modern technologies in the industry, including the critical dependence of product production processes on materials, including silicon wafers.

The company "GERMANIY" is focused on the production of germanium and its compounds, as well as on the technology of processing semiconductor plates.