DiI: Thin Film Matrix Photosensor

2023: Introduction of technology for creating a thin-film matrix photosensor with a wide spectral range

The startup DiIPi of the FlexLab Group of Companies (part of the North-West Nanocenter) has developed a technology for creating a thin-film matrix photosensor with a wide spectral range. An experimental sample of the sensor was produced at the facilities of an industrial partner - the Russian Center for Flexible Electronics (part of the TechnoSpark group). This was announced on November 1, 2023 by the North-West Nanocenter (SZCTT).

The development of a startup is applicable in a large range of optical devices: visualization x-ray devices, biometric sensors, night vision devices. Integration thin-film matrix photosensors will change the usual appearance of these devices in the future, making them more compact and mobile. Light and flexible photosensors do not startup have a rigid form factor and can be used on curved surfaces of various areas. This opens up additional opportunities for industrial implementation. For example, in industrial X-ray installations and non-destructive testing devices for monitoring welds and structural joints of finished structures and materials.

The matrix photosensor of images is based on organic and perovskite materials. The use of this type of semiconductor and the use of printed technologies made it possible to develop an ultra-thin (3 μm), flexible device with special optical characteristics. The ability of a photosensor to record low-intensity light up to nanowatt units provides a large range of radiation energy detection. The introduction of solution methods into the production cycle makes it possible to produce large-area thin-film photosensors.

One of the important qualities of our solution is the optimization of the production process. Instead of producing individual components and then assembling them into a single product, we apply all the functional layers of the photosensor to a flexible transistor matrix, the production of which is specialized in the Russian Center for Flexible Electronics. This allows you to create a device in one technological cycle, which reduces production time and cost, "said Maria Sandzhieva, an engineer at the DiIPi startup.

Testing of the pilot version of the photosensor was carried out jointly with one of the Russian manufacturers of equipment for radiation diagnostics. According to the results of the work, the startup team submitted an application to Rospatent for registration of two developments.

According to the development team, this technology has a high commercialization potential: due to photovoltaic characteristics and an inexpensive manufacturing method, the demand for printed sensors from organic and perovskite semiconductors will grow. According to to data the IDTechEx study, by 2030 the projected market size for devices with integrated thin-film photosensors will be $1.8 billion, of which the share of sensors for X-ray machines is more than $25 million, and for biometric identifications $15 million.