Angstrem Integrated circuits

2017

Integrated circuits in the plastic body

The Angstrem company at the end of December, 2017 announced the beginning of production of the integrated circuits (IC) in the plastic body for use in the special purpose equipment. It is expected that it will allow not only to reduce significantly the cost of an end product, but also to facilitate its weight.

The IC in the plastic body for the special purpose equipment

As of December 22, 2017, in the plastic body chips of standard logic are already issued. The plastic used for production of the body meets all necessary requirements imposed to operating conditions of integrated circuits with the proper quality level and reliability. So, operating temperature range varies from -60 °C to +125 °C.

In such body integrated circuits of foreign producers, including China are in large quantities delivered to Russia. As a rule, they arrive in commercial execution. At the same time the most part from them, after certain tests, is applied in the special equipment, except for space. Bringing to the market a line of chips in the plastic body, we want to increase reliability of the special radio equipment released by domestic enterprises. It becomes within the state program of import substitution and also considering other localization programs including for the mass civil market — the First Deputy CEO of JSC Angstrem Nikolay Plis reported.

Integrated circuits will be involved in the equipment of industrial application and a special purpose. In the nearest future Angstrem is going to master some other products in the plastic SOP body, and in further QFN: chips of DC-DC, ATsP, DAC and others.

Set of large scale integrated circuits

The set of large scale integrated circuits is intended for application in control blocks by temperature of the hydrometeorological Meteor-M spacecraft.

On August 1, 2017 the Angstrem company announced development by request VNIIEM Corporation of pilot batch of a set of the semicustom large scale integrated circuits (LSIC) for the hydrometeorological Meteor-M spacecraft.

Within developmental work on development and transfer of prototypes of VNIIEM Corporation specialists of Angstrem developed a set of chips on the basis of BMC (basic matrix crystal) for the device "Meteor-M". The Integrated Circuits (IC) are intended for the blocks which are responsible for change of temperature condition.

Our integrated circuits will replace import analogs which are now used in weather satellites. The chips developed by Angstrem have more high resistance to factors of space and to influence of heavy charged particles in comparison with foreign analogs that will affect lives of satellites in an orbit — Pavel Mashevich, the director of the center of microelectronics — the chief designer Angstrem

The hydrometeorological Meteor-M spacecraft performs monitoring of weather, collects data for determination of temperature, transfers data of global and local images of overcast, the Earth's surface, ice and snow cover in visible range.

The first start of the Meteor-M spacecraft with the large-scale integrated circuit from Angstrem is planned for December, 2017.