| The name of the base system (platform): | Intel Core |
| Developers: | Congatec |
| Date of the premiere of the system: | 2020/11/10 |
| Last Release Date: | 2021/03/02 |
| Branches: | Electrical and microelectronics |
Main articles:
2021: As part of the congatec starter kit for the COM-HPC Client module with 11th generation Intel Core
On March 2, 2021, congatec, a supplier of technology for embedded and peripheral computing, introduced its COM-HPC launch kit. The evaluation kit is suitable for modular systems using high-speed interface technologies such as PCIe Gen4, USB 4.0 and 2x25 GbE fast connection, as well as integrated MIPI-CSI machine vision capabilities. The starter set is based on a computer-on-module conga-HPC/cTLU made on the open COM-HPC specification of the PICMG consortium, which uses 11th generation Intel Core processor technology (code name Tiger Lake). This next generation of embedded computer modules is designed for system engineers working on broadband peripherals that are increasingly emerging on the industrial Internet of Things (IIoT). Typical vertical markets for such modules include medicine, automation, transportation and autonomous mobility, as well as visual inspection systems for product verification, security systems and video surveillance.
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 | Our launch kit on the open COM-HPC specification, which can be ordered with a selection of individually compiled components from our ecosystem for COM-HPC, allows engineers to move to Gen4 interface technology development and further connectivity. PCIe Gen4 doubles capacity per line compared to Gen3, which affects the overall system design as it allows engineers to double the number of attached expansion devices. Processing all this according to more complex design rules to ensure signal compliance makes it even more important to have a platform for evaluating and pre-testing your own endpoints. says Martin Danzer, Director of Product Management at congatec |  |
The different Ethernet configurations in the starter set range from eight switching options 1GbE or up to two 2.5 GbE, including TSN support, and up to two connections with 10 GbE connectivity. Comprehensive artificial intelligence (AI) support from congatec for MIPI-CSI-connected video cameras from Basler optimizes the availability of applications to the industrial Internet of Things and meet Industry 4.0 requirements for connected embedded systems. The acceleration of artificial intelligence and logic output can be achieved by supporting Intel DL Boost technology, which works with CPU vector neural network instructions (VNNI), or using 8-bit integer instructions on a graphics processor ( Int8). In this context, an important feature is support for the Intel Open Vino for AI ecosystem, which comes with a library of functions and optimized calls for OpenCV and OpenCL cores to speed up the processing of deep neural network workloads across multiple platforms, which is necessary to achieve faster and more accurate AI output results.
The ATX compatible conga-HPC/EVAL-Client carrier board includes all interfaces specified in the COM-HPC Client standard and supports an extended temperature range of -40 ° C to + 85 ° C. The board comes with two PCIe Gen4 x16 slots, plus different LAN bandwidth, data methods, and connectors, including support for two 10 GbE, 2.5 GbE, and 1GbE. According to mezzanine maps, the carrier can run interfaces up to 2x25 GbE, which makes this evaluation platform ideal for connecting mass-connected edge devices. The board supports COM-HPC modules of types A, B and C and includes all interfaces required by engineers for programming, firmware and reset.
The heart of the presented starter set for COM-HPC client projects, the conga-HPC/cTLU module, is available in various processor configurations. For each of these configurations, three different cooling solutions are available that are suitable for the entire tunable TDP power range from 12 to 28 watts for 11th generation Intel Core processors.
2020: Ecosystem Presentation for PICMG COM-HPC
On November 10, 2020, congatec introduced a carrier board and cooling solutions that lay the foundation for the ecosystem for the PICMG COM-HPC standard. They are an important milestone for the integration of COM-HPC and were created to accelerate the implementation and use of congatec COM-HPC modules based on 11th generation Intel Core processors (codenamed Tiger Lake). The COM-HPC standard impresses with a wide range of high-speed interfaces, such as PCIe Gen 4 and USB 4.0, a promising high-speed connector and a full range of features for remote management. The latter is particularly important for all emerging broadband peripheral applications, which range from dedicated peripherals to complex edge clouds and nebulous real-time computing.
| | With our COM-HPC and COM Express solutions, we offer two very attractive uses of Tiger Lake processors from the company. Intel We really want to encourage system engineers to test the COM-HPC platform with all its features and benefits. This is not so difficult to do because our - API interfaces are 100% identical for COM-HCP and COM Express. The latter means that engineers can work on both platforms and easily switch from one to another, - explains Andreas Bergbauer, product line manager at congatec | |
The use of COM-HPC with built-in 11th generation Intel Core processors provides immediate developer benefits, namely PCIe Gen4 compatibility, full USB 4.0, 2.5 GbE, SoundWire, and MIPI-CSI bandwidth. Those who assume that their application will require more or higher performance PCIe or Ethernet interfaces with up to 25 GbE bandwidth should also prefer COM-HPC. In addition, developers who want to scale their high-performance systems to the performance level of peripheral and foggy servers using only one standard get a good argument for implementing everything in COM-HPC, since this can be done immediately and in general. Finally, the ability to use modules that offer more complete remote management features is another reason to purchase and test a new evaluation platform for the COM-HPC standard.
Feature Set Details
An ATX-compatible conga-HPC/EVAL-Client carrier is offered to evaluate COM-HPC solutions. It is designed for orientation purposes and includes all R & D interfaces as well as the firmware required for programming and reset. The COM-HPC carrier also includes all interfaces specified in the new COM-HPC Client standard and supports an extended temperature range of -40 ° C to + 85 ° C. The board supports COM-HPC A, B, and C form factors and has different LAN data bandwidth, data transmission methods, and connectors. To provide maximum flexibility for clients, including Ethernet KR, support for up to two 10 GbE, 2.5 GbE, and 1GbE ports, the board is offered in several options. The board for the latest high-performance add-in cards also has two high-performance PCIe Gen4 x16 connectors. Thanks to mezzanine maps, the carrier can run even up to 4x25 GbE high-performance interfaces on it, making this evaluation platform ideal for connecting mass-connected edge devices.
The COM-HPC module cooling solution is available in three different options and is suitable for the entire customizable TDP range of the 11th generation Intel Core processors - from 12 to 28 watts. COM-HPC modules are available in the following processor configurations:
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