Conga-TC-series COM Express Modules

2022: conga-TC570r COM Express Type 6 with 12th Generation Intel Core Processors

On January 4, 2022, the company congatec , a supplier of technology for embedded and peripheral computing, introduced processors Intel 12th Generation Core for mobile and desktop (PERSONAL COMPUTER formerly code name) Alder Lake on 10 - computers on modules COM-HPC Client and COM Express. More here

2021: conga-TC570r COM Express Type 6 with memory already sealed

On July 14, 2021, Congatec introduced computer modules based on 11th generation Intel Core processors with already sealed RAM for maximum shock and vibration resistance.

Designed to withstand even extreme operating temperature ranges of -40 ° C to + 85 ° C, COM Express Type 6 computer modules provide complete shock and vibration resistance in the harsh operating conditions characteristic of transport and mobile applications. For more price-sensitive applications, congatec also offers a price-optimized option based on Intel Celeron, also resistant to shock and vibration, for a range of operating temperatures from 0 ° C to 60 ° C.

Typical customers of this line of computers-on-modules based on Tiger Lake microarchitecture are OEM manufacturers of rolling stock equipment, commercial, and cars construction agricultural machines, robots with automatic control and many other mobile applications designed for operation in the most difficult environmental conditions - outdoors and off-road.

Shock and vibration resistant stationary devices are another important application of these modules, since digitization requires the protection of critical infrastructure protection (CIP) from earthquakes and other disasters. All of these applications can now benefit from ultra-fast LPDDR4X RAM performing operations at speeds of up to 4266 million transactions per second and in-band error-correcting code (IBECC) in order to ensure resistance to single failures and guarantee high quality data transmission in critical environments with high electromagnetic interference (EMI).

This package includes options for strong installation of the computer-on-module (COM) and carrier board, as well as active and passive cooling options, an additional protective coating for corrosion protection due to moisture or condensation. Also, to ensure maximum reliability, shock resistance and vibration, a list of recommended circuits of the carrier board and components is provided to provide a given temperature range. This set of technical functions is complemented by a comprehensive service offering that includes impact and vibration testing for non-standard system designs, temperature screening (production screening) and high-speed signal integrity testing, as well as design services and all training materials and courses required to facilitate the use of congatec embedded computer technology.

Featured modules based on 11th gen Intel Core processors with low native power consumption and high density, compared to their predecessors provide significantly higher CPU performance and almost three times higher graphics performance, processor as well as PCIe Gen4 support. For the most demanding graphics and computing workloads, you can use up to 4 cores, 8 threads, and up to 96 graphics execution blocks, providing high concurrent throughput in ultra-reliable form.

Integrated graphics not only support 8k displays or four 4k displays. It can also be used as a parallel processing unit for convolutional neural networks (CNN) or as an artificial intelligence (AI) accelerator and deep learning systems.

The Intel AVX-512 Instruction Block with Vector Neural Network Instruction (VNNI) integrated into the CPU is another feature that accelerates AI applications. Using the program Intel OpenVINO tools which include the optimized calls for OpenCV, of kernels of OpenCL and other branch tools and libraries, for acceleration of workloads of AI, including computer sight, audio, the speech and the systems of recognition of language, workloads can be expanded on computing CPU, GPU and FPGA blocks.

TDP power scales from 12 watts to 28 watts, which allows you to create completely sealed systems only with passive cooling. The high performance of the conga-TC570r COM Express Type 6 ultra-strong module to deploy virtual machines and consolidate workloads in boundary computing scenarios was implemented in a real-time design, including support for Time Sensitive Networking (TSN), Intel Time Coordinated Computing (TCC) technology, and TCC.

2020: conga-TC570 COM Express Compact

On September 3, 2020 сongatec , the embedded technology provider computers announced the release of its first two products based on them - a client module in form factor A - COM-HPC Client size A and a compact next-generation COM Express computer-on-module. This gives engineers choices to further increase the performance of their existing systems or develop next-generation products using a wide range of COM-HPC interfaces. OEMs will benefit from performance improvements, as well as communications management and real-time improvements that provide 11th processors Intel generation modules designed for the embedded computing sector. Typical applications of congatec products can be found in a variety of embedded solutions, from embedded systems and nodes to peripheral computing network hubs, from local foggy to Data Center basic network devices, as well as in central cloudy processing centers for data mission-critical applications. state

First Next Generation COM-HPC and COM Express

The 11th generation Intel Core processor-based congatec modules offer CPU/GPU computing capabilities with built-in acceleration using artificial intelligence technology, as well as real-time data processing capabilities for mission-critical applications that require high-speed data processing, computer vision, and low-latency deterministic computing. told Gerhard Edi, congatec CTO

According to the company, the main features of the Tiger Lake UP3 processor provide increased performance, allow DDR4 memory, PCIe Gen4 USB and 4.0 bandwidth. These performance improvements are complemented by features that are critical to connected peripherals computers that need to be processed data in real time, such as hardware support for virtualizations technologies hypervisor such as real time systems. Everything in general is delivered in the case " Intel s SuperFin providing economy, energy necessary physical density and computing power for the set thermal ranges.

In addition to PCIe Gen 4, congatec computer modules with 11th generation Intel Core processors also offer USB 4.0, which is mainly based on Intel Thunderbolt technology. USB 4.0 supports up to 40 Gb/s of data transfer and PCIe 4.0 tunneling, as well as DP-Alt mode, which supports video signals with up to 8k resolution with 10-bit HDR at 60 Hz.

The 11th generation Intel Core processor (codenamed Tiger Lake UP3) comes in both form factors: COM Express (conga-TC570) and COM HPC (conga-HPC/cTLU)

The COM-HPC client module in form factor A and the conga-HPC/cTLU module, as well as the COM Express Compact conga-TC570, will be available with various 11th generation processors Intel Core from the Intel Tiger Lake roadmap. Both modules support PCIe x4 as Gen 4 for proper bandwidth external peripherals. In addition, developers can use 8 PCIe Gen 3.0 lines. The COM-HPC module offers two USB 4.0 ports and two USB 3.2 Gen 2 and 8x USB 2.0 ports, and the COM Express module offers four USB 3.2 Gen 2 ports and eight USB 2.0 ports according to the PICMG specification. COM-HPC offers 2x 2.5 GbE for network operation, while COM Express modules execute 1x GbE, and both with TSN support. Audio is provided via I2S, SoundWire via COM-HPC and HDA via COM Express modules. For various operating systems Real-Time Operating Systems (RTOS), comprehensive card support packages are provided, including hypervisor support from real-time systems, as well as operating systems, and. Linux Windows Chrome

2019: conga-TC370 COM Express Type 6 based on 8th generation Intel Core for mobile applications

On June 11, 2019, the company congatec announced the release of embedded versions of processors Intel Core 8th generation boards (code name Whiskey Lake) for. mobile applications For June 2019, compact modules COM Express Type 6, (3.5 "Single Board Computers single-board computer) and. According Thin Mini-ITX Motherboards to the manufacturer, when using them, OEM clients benefit from performance improvements of up to 58% compared to previous embedded boards on U-series processors and with support for four cores instead of two, plus a common improved microarchitecture. With features such as optional 2-generation or Intel Optane USB 3.1 second-generation memory, solving everyday computer computing problems becomes more flexible. Processor cores provide efficient task planning and, in addition, support company usage to further optimize I/O throughput from input channels to processor cores software hypervisor. Real-Time Systems (RTS)

Embedded boards and modules based on the high-performance Intel Core i7, Core i5, Core i3, and Celeron processors are designed to work in harsh environments and space. According to the developer, they offer customers long-term availability for more than ten years. Designed primarily to meet the growing lifecycle needs of the transport and mobility sector, these boards and modules, as they extend the lifespan of the cycle at no additional cost to their customers, are also suitable for all other embedded application markets - such as medical equipment and industrial controls and automation, embedded peripheral clients, and human-machine interfaces.

"One of our main goals is to make it as easy as possible for our OEM customers to use embedded computer technology. This is why we offer our embedded boards and modules based on 8th generation Intel Core processors for mobile applications with long-term availability of more than a decade, based on a specific last purchase contract and up to fifteen years of long-term availability from the start of the acquisition. We have taken this step, as seven years is often insufficient for many sectors of the market for high-performance embedded computer applications. Thus, our offering of embedded and extended lifecycle modules helps OEMs extend the lifecycles of their products for even greater payback, " noted' Christian Eder, Marketing Director at congatec '

"We now have the opportunity to get embedded versions of boards and modules based on Intel architecture with more than a decade of availability. Longer lifecycles are a key requirement in many mobile applications that we focus on designing and manufacturing systems designed to operate under harsh environmental conditions - where it is necessary to collect and record high-speed data streams for recognizing 3D objects, obtaining lidar images and mapping on mobile devices. Our end customers expect the same capabilities from their supplied data recorders used to monitor wireless networks and automotive test systems, or data recorders to test new vehicles that store and analyze high-speed data streams from external sensors on SSDs or hard drives. " noted Thomas Hagios CEO of MCTX Mobile & Embedded Computers GmbH

As noted in congatec, conga-TC370 COM Express Type 6 modules, embedded 3.5-inch single-board computers (SBC) conga-JC370 and conga-IC370 Thin Mini-ITX motherboards are equipped with Intel Core i7, Core i5, Core and Celeron processors with a five-year availability. The memory is designed to meet the application consolidation requirements for multiple operating systems (OS) on a single platform. For this purpose, two DDR4 SODIMM connectors with up to 2400 million transactions per second with a total memory capacity of up to 64 GB are available. USB 3.1 Gen2 is initially supported, which allows you to transfer even uncompressed UHD video from a USB camera or any other sensor of the machine vision system. 3.5-inch single-board PCs provide high performance through a USB-C connector that also supports single DisplayPort++ and simultaneous power supply for peripherals, thereby providing a single cable monitor for video, touch, and power. COM Express modules support the same feature set on all carriers. Further interfaces depend on the form factor, but they all support three independent UHD displays with a frame frequency of 60 Hz and with a resolution of up to 4096x2304 pixels, as well as one Gigabit Ethernet (with TSN support). The presented boards and modules offer all this in combination, including other interfaces, with a cost-effective TDP of only 15 W, which scales from 10 W (800 MHz) to 25 W (up to 4.6 GHz in Turbo Boost mode).

2018: COM Express Type 7 Server Module View

On December 4, 2018, the company Congatec introduced modular computing platforms for connected on-board, passenger infotainment applications and entertainment systems. augmented reality Server The COM Express Type 7 modules designed for convergent edge servers, for aircraft, are suitable for content screen delivery applications embedded in passenger seats and mobile passenger devices, as well as for intelligent maintenance and other applications based on (), big data Big Data including:, as well as video surveillance systems flight data based on. According cloud computing to the developer, these platforms are also suitable for applications with in aviation, augmented reality allowing to optimize capabilities navigation in places with low visibility, they are applicable in the basis virtual assistants aimed at artificial intelligence increasing the productivity and efficiency of airliners, as well as to increase the overall comfort of passengers during the flight.

author ' = Christian Eder, Marketing Director, Congatec ' "Modern technological trends, such as industrial Internet of Things (IIoT) and communications 5G , to the satellite are making changes to many IT aircraft systems. In this scenario, both in existing equipment from the liner manufacturer and in modified applications, border servers of aircraft will play an important role, which will allow airlines, crews and passengers to use a wide variety of server services. With Server-on-Modules, engineers adapt the performance of their virtualized on-board edge servers to specific needs and easily scale core performance in closed-loop cycles as easily and efficiently by replacing modules. "

As noted in congatec, server-on-modules also help solve the problems of moral and physical aging of equipment, since standardized modules can be easily upgraded and built into the already existing design. In addition, tightly packed reliable modules help optimize the SWaP-C requirements (weight and size characteristics and power consumption) of modern on-board applications due to their more compact and less weight, but at the same time highly efficient and economically optimal layout.

According to the developer, the edge server platforms for aircraft are based on COM Express Type 7 servers approved by PICMG and are equipped with Intel Atom, Intel Pentium and Xeon processors. They meet all the requirements for working in harsh conditions characteristic of aircraft, including support for extended operating temperature ranges, as well as high resistance to impacts and vibration. Having an additional coating for afforestation of moisture resistance, they are certified for compliance with the requirements of the DO-160G standard in terms of working in climatic conditions of the operating environment. Engineers using the COM Express Type 7 server-on-modules offer benefits not only from their end-to-end application processing core, which simplifies technology development, but also through Congatec's full support package for OEM projects.

As of December 2018, edge server platforms for aircraft can be ordered in the following configurations, including support for personal integration for OEMs already fully ready for use commercially available products: