Congatec: Cooling systems for single board computers (SBC)

2020: Submission of solutions for cooling of the 3.5-inch single board computer

On March 2, 2020 the congatec company presented three solutions of cooling systems of a premium class for the built-in 3.5-inch single board computers (SBC). PICMG based on specifications for the standardized heatdistributors of payments COM Express and thanks to their very big occupied space, they provide the maximum cooling weight and big surface area for powerful 3.5-inch single-board constructions. Heat dissipation is standardized, and all solutions are equipped with the massive heat sink manufactured of light alloy which quickly and effectively disseminates the departing heat from hot spots of the processor. Depending on design requirements on the heat sink (TDP), the heatdistributor can be complemented with passive finned radiators or impingement cooling systems (active ventilation). With three solutions for cooling of standard height proposed by congatec company, OEM manufacturing can implement in the future solutions for cooling, identical by the size, at comparable requirements for TDP. It, according to the developer, will facilitate scaling of the 3.5-inch built-in systems based on single board computers between several generations of processors. The first configurations of own solutions already fully completed for cooling are optimized for use with the 3.5-inch single board computers conga-JC370 executed based on the Intel processors Core of the 8th generation (the code name Whiskey Lake).

"To facilitate to customers development on the basis of the built-in systems, our strategy is creation of the individual, reliable cooling solutions for our computer products of all available form factors long ago. They are standardized and when using cooling provide significant increase in error-free running time (MTBF). Continuing this strategy, we also developed the solution for cooling of our 3.5-inch single-board solutions. They considerably differs from normal 3.5-inch single board computers in which the processor and input/output ports are on one party of a payment. Having installed our solution on a bottom side of a payment, we create much more the place for massive cooling systems and at the same time we facilitate to developers design of their final systems as both connection of the body, and an internal air heat-removing flow of a system are standardized", 'Martin Danzer, the director of product management in congatec company noted'

As noted in congatec, the offered cooling systems use almost all surface of the space of 146×102 mm occupied by them. Three provided cooling systems are intended for 3.5-inch single board computers and developed taking into account future processors which need refrigerating capacity up to 45 W in the modes by temporary restriction regarding TDPP. They consist of a teplootvodchik without cooling edges which disseminates the fulfilled heat in the body and also a passive radiator with edges of cooling and have option of active cooling with the integral fan. At high loads for passive option of cooling it is recommended to use the external system fan. At the same time active (forced) cooling is expected independent operation. To make system integration easy and flexible, each of the listed above solutions of cooling is available in options with the threaded and drilled end-to-end openings.

The system of forced (active) cooling based on fans which is used, for example, in the 3.5-inch systems with the Intel processors Core i7 of the 8th 25 W generation (i7-8665UE has the code name Whiskey Lake), is specially developed for the round-the-clock continuous (24×7) works under trying conditions of the industrial environment. Fans not only are reliably fixed in this complete cooling system, but also specially fixed to reduce their wear. The bearings used in them are equipped with special consolidation and an additional cover for ensuring protection of mechanics and preserving of lubricant. Thanks to the high-quality synthetic oil used as lubricant, the fan has a time between failures of MTBF in several decades. And with the industrial operating temperature range-45 … +85 °C, with fulfillment of requirements on an udaroproprochnost and vibration resistance for the equipment of an industrial class, approve it in congatec.