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Intel Xeon D-series

Product
Developers: Intel
Date of the premiere of the system: February, 2018
Technology: Processors

2018: Xeon D-2100

At the beginning of February, 2018 the Intel company officially provided processors of Xeon D-2100. Devices are distinguished by a high integration scale and additional functions of input-output that allows to provide a high ratio of performance per watt. The line of D-2100 left almost in three years after D-1500 family on the basis of Broadwell EP. D-2100 devices are based on architecture of Skylake.

Processor of Xeon D-2100

In total 14 models of a line of Xeon D-2100 are provided. They are focused on clients of Edge Server, Cloud, Edge Network, Storage and QuickAssist. Interpretation of the name of models:

  • I: built-in Intel Ethernet
  • T: works at high temperatures
  • N: support of QuickAssist and Intel Ethernet

Except for Xeon of D-2191, the most powerful processor in a line of Xeon of D-2100 with 18 cores, all CPU are equipped with four controllers 10 Gigabit Ethernet. In case of Xeon of D-2191 support of these interfaces is possible via external MAC/PHY controllers. As for memory, all processors support DDR4-2133 with ECC — as in the form of RDIMM, and LRDIMM. Depending on the CPU model, support of DDR4-2666 is possible.

Basic frequency of all of CPU is from 1.6 to 2.3 GHz. As well as Boost frequency, basic frequency depends on number of cores (and other factors) which change from 4 to 18. All processors can reach Boost frequency to 3.0 GHz, but for all cores the frequency of Boost is from 2.2 to 2.8 GHz. As for a thermal packet of TDP, it makes from 65 to 110 W.

As the architecture of Skylake-SP is used, processors of a line of Xeon D-2100 contain 1 MB of a cache of L2 and 1.375 MB of a cache of L3 on a core. Processors of Xeon of D got support of an expanded packet of instructions AVX-512. On the processor 32 PCI Express lines are available, 20 more provides a chipset.

Expansion of functions of input-output means also that processors of a line of Xeon D-2100 will be put into packaging under name BGA2518 which amount are 45 × 52.5 mm. Processors will be soldered on motherboards Supermicro, ASRock and other companies. Exact date of an exit of products on the basis of processors of Xeon D-2100 is still unknown.[1]

Notes