RSS
Логотип
Баннер в шапке 1
Баннер в шапке 2

Multi-Bridge-Channel FET (MBCFET)

Product
Developers: Samsung Electronics
Date of the premiere of the system: July 2022
Branches: Electrical and Microelectronics

2022: Samsung begins shipping world's first 3nm chips

On July 25, 2022, it became known that Samsung Electronics began supplying chips manufactured using the world's most advanced 3-nanometer production technology, which significantly improved power consumption and performance.

In late July 2022, the tech giant held an event to send the first batch of 3nm chips from a plant in Hwason, Gyeonggi province, attended by about 100 company and government representatives.

Samsung begins shipping 3nm chips

The 3nm chip technology will put Samsung ahead of rival TSMC. Despite its superiority in memory chip manufacturing, Samsung remains in second place in the growing foundry market with a share of less than 20%, while TSMC dominates more than 50% of the global market.

Samsung's 3nm technology features a higher transistor density than the current 5nm technology, which means faster speeds and less power consumption for advanced chips for artificial intelligence systems, big data processing and autonomous cars.

Samsung was also the first to adopt a more advanced transistor architecture, called "gate-all-around field-effect transistor technology" (GAAFET), which has improved the overall efficiency of the current FinFET technology.

Samsung has branded its GAAFET technology as "Multi-Bridge-Channel FET (MBCFET)."

GAAFET is considered essential for making the next-generation foundry chips, which are smaller than 3nm, but chipmakers are struggling to raise their performance figures early in production.

According to Samsung, its engineers began research on GAAFET technology in the early 2000s and have been applying it to the upcoming 3nm manufacturing process since 2017. In June 2022, the company officially announced the mass production of 3nm chips, becoming the first chipmaker to do so.

File:Aquote1.png
The release of the latest 3nm chips is a milestone for Samsung's foundry industry, "Kyung Ki-hyun, CEO of Samsung's chip division, said at the event. At a time when FinFET technology is approaching its limit, we managed to develop an alternative GAAFET technology before others. This is the result of innovation.
File:Aquote2.png

As a result of the overall technology update, Samsung said its 3nm first-generation process technology reduced power consumption by 45% and improved performance by 23% over the current 5nm process technology using FinFET.

In the second generation, power consumption is expected to halve, and performance will increase by another 30%.

Samsung uses the latest technology primarily in HPC chips and plans to diversify their application in partnership with customers.[1]

Notes

Шаблон:Remarks