Developers: | Samsung Electronics |
Date of the premiere of the system: | June 2021 g |
Branches: | Electrical and microelectronics |
2021: Start production of the first modules combining RAM and Flash memory
On June 15, 2021, Samsung announced the launch of the production of the first modules combining DRAM LPDDR5 and UFS 3.1 flash memory. According to the developers, the new product will allow you to create inexpensive smartphones with characteristics comparable to the capabilities of flagship devices.
uMCP modules (UFS-based multichip package) have a RAM capacity of 25 GB/s (LPDDR4X memory has this figure of 17 GB/s), and built-in flash memory allows data to be transmitted at speeds of up to 3 GB/s (versus 1.5 GB/s for UFS 2.2). Such characteristics should positively affect the work of applications in the areas of augmented reality, 5G networks, as well as when working with photos and in games, the manufacturer claims.
In addition, the integrated DRAM/NAND solution has an area of 11.5x13 mm, which gives space for other components inside the smartphone case. According to Samsung, the first LPDDR5 uMCP module provides the highest performance and storage capacity at very low power consumption.
The uMCP LPDDR5 module is based on our rich legacy of memory improvements and know-how in the field of packaging, allowing consumers to enjoy continuous streaming, games and mixed reality even on lower-level devices, "said Samsung top manager Young Su Song. |
Samsung intends to sell uMCP solutions in different capacity options. The amount of RAM, in particular, can vary from 6 to 12 GB, and the capacity of the flash drive - from 128 to 512 GB. Devices with uMCP memory will go on sale in the summer of 2021. It is noted that the technology has already been tested in smartphones of large manufacturers (their names are not called).[1]