NIITM (Research Institute of Precision Engineering)

History

2025: Announcement of a plant for plasma chemical deposition on 300 mm silicon wafers

The first Russian installation for plasma chemical deposition on 300-mm silicon plates was presented in March 2025. The development was carried out by the Research Institute of Precision Engineering (NIITM), which is part of the Element Group of Companies. Before the advent of this equipment, there were no analogues on the Russian market for working with plates of this diameter, and the entire production base was focused on imported solutions or installations designed for 200-mm substrates.

According to Izvestia, plates with a diameter of 300 mm are today the world standard, which produces more than 90% of microcircuits. This size significantly increases the number of chips produced on a single substrate, which ultimately reduces their cost to the consumer.

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Фото: Freepik

The head of the advanced development department of NIITM Georgy Yeritsyan emphasized that the new complex is designed to process silicon wafers with a diameter of 300 mm, but has the ability to change the configuration for working with 200 mm wafers. This ensures a smooth transition of production from existing technological processes to new standards.

One of the key achievements of NIITM specialists was the localization of production of a significant number of components of equipment in a short time. At the same time, the developed basic technological processes are not inferior to imported analogues. Georgy Yeritsyan noted that the creation of a line of domestic industrial installations adapted to the 300-mm format will strengthen the country's technological sovereignty and its position in the world market.

Development of the plant began at the end of 2021. During this time, engineering scientists manufactured a prototype cluster structure consisting of four different technological modules combined by a common robotic transport system to move the plates.^[1]

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