Plant of semiconductor devices

"The plant of semiconductor devices" is founded in 1941, in Yoshkar-Ola.

Is a part of Russian Electronics company.

History

2016: The technology of Kyocera is mastered

On September 27, 2016 the Ruselectronics company announced mastering of the technology allowing to reduce overall dimensions of the body of chips with increase in their performance.

Production upgrade of "The plant of semiconductor devices" is executed at the expense of own enterprise assets on the basis of the equipment and technologies of the Japanese company Kyocera "Ruselectronics"^[1].

ZPP brought section of casting of a ceramic tape and the line of work with thin ceramic layers into operation that provided an exit to a design standard - 100/100 (width of elements of metallization from 100 microns, distance between elements - from 100 microns). The equipment allowing to create a ceramic film from 75 microns thick, to put flat metallization, to manufacture the body with number of layers more than 30 is installed.

The technology helps to implement with miniature leadless packages the bigger number of electrical connections, both within one layer, and between different layers (more than 25 thousand interlayered transitions on one product). There were more opportunities for reduction of overall dimensions of ceramic-metal payments when developing multichip modules and multilead packages with a large number of conductors and buses due to consolidation of the topological drawing.

The possibility of formation of windows, openings and grooves on a ceramic payment of any geometrical form upon the demand of the customer is implemented. Construction of a cover of the body is changed – the rim on perimeter is executed by thinner, than the central part, for the purpose of simplification of orientation of an element when sealing. At the same time the big thickness of the center of a cover provides rigidity of construction, necessary for protection against mechanical influences.

ZPP carried out works on selection of the modes of drawing laser marking on a body cover.

Notes