Angstrem T of Multi-Project Wafer (MPW)

Multi-Project Wafer(MPW) is service within which placement on one plate of 200 mm of chips in size of several customers is offered at once. It gives the chance to reduce cost for each customer, so to spend considerably smaller means for receiving the first samples of the developed products.

2018: Shipment of the first commercial batch of MPW

On August 9, 2018 the Angstrem T company announced shipment at the end of July of the first commercial batch on MPW. The batch contained 50 plates with a diameter of 200 mm executed on AT250G technology which is a part of technical process on 90 nanometers. The Russian design centers acted as customers. Release of the following batch of MPW plates it is planned for October, 2018.

In total on plates 14 products were placed: microcontrollers of two standard ratings, six sensors, three analog-to-digital converters and three types of drivers of power management. Chips are held for use in industrial automatic equipment and consumer electronics. These products were developed in six different design centers located in Moscow, Voronezh and Yekaterinburg.

The first batch of crystals of chips was sent to customers for testing and, if necessary, entering of amendments into topology of products. Based on these completions agreement signature about release of serial batches of chips is planned.

2017: Start of service of MPW

In the fall of 2017 the Angstrem T company started service of Multi-Project Wafer (MPW) for developers. Earlier placement on one plate of 200 mm of chips in size of several customers was available at once only at foreign factories.

Starts of batches of MPW of plates happen quarterly. Within promotion of this service on November 21, 2017 the Angstrem T signed the agreement with Association of the Russian universities on the electronic component base (ECB) assuming release at the enterprise of the chips developed by students. Read more here.