Developers: | MediaTek |
Date of the premiere of the system: | 2021/11/19 |
Technology: | Processors |
Content |
The main articles are:
2023: Creating the world's first 3nm smartphone processor
On September 7, 2023, the Taiwanese semiconductor company MediaTek announced the development of the first processor for smartphones, which will use 3nm technology.
The product, created in collaboration with TSMC specialists, will be included in the Dimensity family of flagship chips. As of the beginning of September 2023, the technical characteristics of the solution were not disclosed. But it is said that it will find application not only in cellular devices, but also in tablets, intelligent automotive systems and other electronic devices. MediaTek chips are used by companies such as Oppo, Samsung, Vivo, Xiaomi and others.
Mass production of the processor at TSMC will begin in 2024. It is claimed that compared to 5nm TSMC N5 technology, a 3nm technique will provide 18 percent faster performance while maintaining the same level of power consumption. On the other hand, it is possible to reduce energy costs by almost a third (by 32%) with comparable productivity. The density of the logic elements increases by about 60%.
The collaboration between MediaTek and TSMC on the new Dimensity processor means the power of the industry's most advanced semiconductor technology can be as accessible as a smartphone in your pocket. We have worked closely with MediaTek over the years to bring many innovative developments to market, and we are honored to continue this partnership in terms of commercializing 3nm chips and beyond, "said Dr. Cliff Hou, TSMC Senior Vice President, Sales Europe and Asia. |
Gadgets and other devices equipped with 3nm Dimensity chips will begin to appear on the commercial market in the second half of 2024.[1]
2021: Dimensity 9000
On November 19, 2021, it became known that MediaTek created the Dimensity 9000 processor. This is a four-nanometer processor ready for mass production.
As reported, the Taiwanese MediaTek does not specify whether it has ready-made processor samples on hand, but promises that the first devices based on Dimensity 9000 will go on sale in the first quarter of 2022.
The CPU is focused on use primarily in smartphones. This is a direct competitor to the upcoming American Qualcomm Snapdragon 898 (the name may change). The release of both chips will be handled by TSMC.
MediaTek decided to make the Dimensity 9000 a three-cluster. The first cluster contains the only productive ARM Cortex X2 core, giving a frequency of 3.05 GHz. Three Cortex A710 cores are separately grouped at 2.85 GHz, and the third cluster houses a quartet of Cortex-A510 cores clocked at 1.8 GHz.
In total, the Dimensity 9000 has eight cores. The Mali G710 video subsystem with 10 cores is responsible for graphics processing in it.
At the same time, the processor also has a separate fifth generation six-core APU module. It will be used to speed up calculations related to artificial intelligence.
The processor claims 8 MB of L3 cache and additional 6 MB of system cache.
Speaking about the Dimensity 9000 parameters, Dimensity representatives mentioned the presence of an 18-line digital signal processor (DSP) for image processing. It is capable of interacting with sensors up to 320 megapixels and working with three simultaneous video streams in 4K HDR format.
The processor supports screens with an update rate of up to 180 Hz and the LPDDR5X memory standard, the production of modules of which began in November 2021. Not without the standard modem for accessing fifth-generation networks (), 5G which Russia are not yet available.
Of the wireless modules, it should be noted the presence of Bluetooth 5.3 and Wi-Fi 6E.
Among the first devices with the processor will be the Vivo V2184, which has already been tested in this synthetic test, although not yet officially announced.
Vivo from the Chinese holding VVK will not be the only one who will release smartphones with Dimensity 9000 inside. According to the Gizchina portal, this hardware platform also interested other vendors, mainly Chinese[2].