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NTT: Modules for communication networks

Product
Developers: Nippon Telegraph and Telephone (NTT)
Date of the premiere of the system: February 2023
Branches: Telecommunications and Communications

2023: Product Announcement

On February 23, 2023, Japanese telecommunications corporation NTT announced the creation of an ultra-compact integrated circuit (IC) based amplifier module for communication networks. The product provides the ability to transfer data from speed more than 2 Tbit/s.

The solution, as noted, is suitable for future, sixth generation mobile networks (6G) as well as IOWN (Innovative Optical and Wireless Network) communication systems. Current 5G millimeter band infrastructures use frequencies from 24 to 40 GHz. For 6G networks, it is planned to allocate frequencies from 100 GHz to 1 THz. And it is on the 100 GHz band that the new NTT product is designed.

The NTT chip allows you to increase the speed of Internet access up to 2 TB/s

One of the main problems associated with the use of high frequencies in electronics is significant signal attenuation. In addition, there are distortions caused by non-linear characteristics of hardware components. NTT specialists managed to solve these problems. The researchers used indium phosphide (InP HBT) -based bipolar heterojunction transistor technology. Additionally, the DC interlock function was implemented: it prevents failures and malfunctions when connecting devices with different operating voltages.

The developers have demonstrated that the new module is capable of amplifying an ultra-wideband signal without distortion with amplitude-pulse modulation of PAM-4 and a speed of 112 GB (billion modulations per second). It is said that the size of the amplifier integrated circuit is only 1 × 1 mm. At the same time, the dimensions of the module itself are 11.8 × 10 × 4.3 mm. NTT Corporation expects that its development will accelerate the deployment of high-speed next-generation communication networks. In the medium term, the company will continue to improve its technology for installing integrated circuits and cases, as well as explore the areas of possible use of ultra-high-speed transceivers.[1]

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