Cluster systems for plasma chemical deposition and etching processes

History

2025: Product Announcement

In December 2025, Element Group of Companies announced the development and assembly of the first cluster systems in Russia for plasma chemical deposition and etching processes. Plants can be used as part of production lines for the production of integrated circuits according to topological standards of 65 nm on plates with diameters of 200 mm and 300 mm. Russian organizations are among the five companies in the world with competencies in the development and production of this class of technological equipment.

The lead contractor of the project was NIIME, which ensured the construction of clean production facilities, the installation and connection of prototypes of equipment, the development of technological processes and the testing of equipment. The main co-executive officer was NIITM, whose specialists developed the equipment itself and participated in the tests. Both enterprises are part of the Element ledger.

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Фото: Freepik

The Ministry of Industry and Trade noted that the creation of the first Russian cluster systems for plasma chemical deposition and etching is an important practical result. Installations for the level of 65 nm on 300 mm plates will provide, among other things, a promising need for domestic microelectronics.

Of particular value is the modularity of the platform - it allows you to work out processes on existing equipment and serves as the basis for the transition to thinner technical processes. The ministry stressed that the project demonstrates the ability of cooperation between scientific institutions and industry to solve the most difficult technological problems.

In world practice, cluster-type equipment is used as a standard for the production of microcircuits, since it allows you to combine from 2 to 8 process units with a common loading system. This makes it possible to consistently carry out a number of technological processes without unloading the plates into the atmospheric environment of the room.

The modular structure allows you to flexibly configure the equipment depending on the needs and capacity of the production facilities. All these factors affect the reduction in the cost of production and the improvement in the quality of chips. Insulation of the plates from the external environment between operations reduces pollution and increases the yield of suitable products.^[1]

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