MediaTek Helio-series Chipsets

MediaTek Helio is a series of chipsets.

2021: Vulnerabilities in processors that allow you to listen to phone conversations

At the end of November 2021, vulnerabilities in MediaTek processors were discovered by Check Point Software Technologies, they could allow attackers to eavesdrop on phone conversations on Android, execute commands or increase their privileges on systems to a higher level.

Three of the vulnerabilities CVE-2021-0661, CVE-2021-0662, CVE-2021-0663 were eliminated in the MediaTek security bulletin in October 2021, and the fourth CVE-2021-0673 in the security update, which will be released in December 2021. These defects mean that all smartphones using MediaTek chips are vulnerable to listening attacks or infection with malicious software (software) that does not require user intervention unless security updates are installed. For a significant number of older devices that are no longer supported by manufacturers, a security update is likely to never be installed.

Holes in MediaTek processors allow you to listen to phone conversations in millions of smartphones

Modern MediaTek processors use a dedicated audio processing unit called Digital Signal Processor (DSP) to reduce processor load and improve audio playback quality and performance. This unit receives audio processing requests from applications in the Android user space through the interprocessor communication driver (IPC). Theoretically, a non-privileged application can exploit disadvantages to manipulate query handlers and run code on an audio chip. The audio driver does not communicate directly with the DSP, but with IPI messages sent to the system control processor (SCP).

By reverse engineering the Android API, which is responsible for audio communications, Check Point, an information technology security company, learned more about how the system works, which led to the detection of the following vulnerabilities:

• CVE-2021-0673 - Details to be disclosed in December 2021;
• CVE-2021-0661 - Incorrect boundary check leading to out-of-bounds write and local privilege elevation;
• CVE-2021-0662 - Incorrect boundary check leading to out-of-bounds write and local privilege elevation;
• CVE-2021-0663 - Incorrect boundary check leading to out-of-bounds write and local privilege elevation.

By connecting these flaws in a chain, an attacker can potentially perform local privilege attacks, send messages to the digital signal processor (DSP) firmware, and then hide or run the code on the DSP chip itself.

MediaTek removed the option of using the parameter string command via the AudioManager used to operate the CVE-2021-0673, which significantly mitigates the problem. More information about the vulnerability of CVE-2021-0673 will be published MediaTek in the next security bulletin, which will be released in December 2021. The remaining three vulnerabilities CVE-2021-0661, CVE-2021-0662, CVE-2021-0663 were fixed in Android security updates released at the patch level in early October and mid-November 2021. MediaTek is the largest semiconductor company in the world, its chips are present in 43% of all smartphones as of Q2 2021 ^[1]

2018

Implementation of ARCore platform and Google Lens application in Helio P90

The MediaTek company declared on December 14, 2018 completion of testing and introduction of the ARCore platform and Google application of Lens in a high-performance chipset of Helio P90. The company worked closely with Google to provide the Helio P90 - the latest release on December 14 in the Help P family - with optimized support for augmented reality technology.

MediaTek implements this technology throughout its technology portfolio and the Helio P. family. For example, the Helio P60 and Helio P70 chipsets have already been certified for work with ARCore and Google Lens.

ARCore provides extensive augmented reality capabilities for smartphones, so developers can create exciting AR products without the need to use additional hardware or complex algorithms, the company said.

According to the developers, the Helio P90 chipset is designed to optimize processor performance and save energy even in such energy-intensive tasks as working with AR applications. MediaTek worked closely with Google to pre-test ARCore on its Helio P90 chipset. The company has prepared a ready-made development sample for ARCore, which helps device manufacturers simplify the development process and accelerate product launch. The company will also help its customers in the process of certification of ARCore according to their needs.

MediaTek also optimized the performance of the camera software of the Helio P90 chipset to support the Google Lens application, which allows users to search for information about what they see in front of themselves, perform work faster and interact more closely with the outside world. The company will provide software support for the Google Lens application so that OEMs can easily develop devices for different levels of their technology portfolio.

MediaTek has long partnered with Google to create advanced mobile technologies and offer them to consumers at average prices. As a result of our last collaboration, we enable more smartphone users to experience the capabilities of augmented reality technology and Lens visual search in their daily lives, "said TL Lee, general manager of the MediaTek wireless communications division. - Now that the Helio P90 chipset supports ARCore and Google Lens, we will work closely with mobile manufacturers to provide them with comprehensive support. So they can quickly develop and market devices optimized for AR applications and Lens.

Starting in the fourth quarter of 2018, MediaTek will support ARCore and Google Lens on Helio P90 chipsets for devices created to work with Android Pie. The company also intends to expand support for the ARCore platform and the Google Lens application for other chipsets in the Helio family in 2019.

Helio P90

On December 13, 2018, MediaTek announced the launch of the Helio P90 on-chip (SoC) system, which supports APU 2.0, a multi-core AI data processing unit with increased speed. Thanks to the performance of 1127 GMACs (2.25TOPs), the Helio P90 provides power worthy of flagship smartphones, the developer claims.

According to the developer, APU 2.0, created MediaTek and built into the Helio P90 data processing unit, provides four times more efficient work with AI processes than on the Helio P70 and Helio P60 chipsets. It helps users solve time-consuming AI tasks, getting a better result faster and at the same time providing longer battery life.

author ' = TL Lee, General Manager, Wireless Division MediaTek ' "The Helio P90 allows device manufacturers to offer users impressive camera capabilities, long battery life, high performance, and access to advanced AI capabilities. At the same time, devices can remain accessible to consumers of the mass market. The Helio P90 delivers high-performance AI processes and image enhancements based on AI. This chipset will change users' perceptions of what smartphones are capable of and will open a new era of ultra-high-resolution photos on mobile devices. "

The octa-core Helio P90 includes two processor ARM A75 at 2.2 GHz and six A55 processors at 2.0 GHz. GPU - Imagination Technologies PowerVR GM 9446. The technology developed in MediaTek CorePilot also ensures the efficient distribution of all processes to all nuclei. According to the developer, this means that Helio P90 will provide users with high-reliability performance, efficient energy consumption, creating the optimal balance between energy saving and performance.

Helio P90 AI technologies enable faster processing of more complex and dynamic AI processes. For example, they can recognize a person's posture by monitoring and analyzing body movements. In addition, it supports Google Lens, facial recognition technology, real-time buoyancy, definition of the object and conditions of shooting, augmented and mixed reality technologies, as well as other improvements for photos and videos in real-time. Developers and manufacturers of mobile devices can create innovative AI applications using Helio P90 using common sets of tools for AI, including TensorFlow, TF Lite, Caffe, Caffe2, based on the NeuroPilot SDK , which is fully compatible with the Google Android Neural Networks API (Android NNAPI), according to MediaTek.

According to the developer, Helio P90 allows users to take high-quality photos thanks to hardware support for an enlarged single camera 48 Mp or double camera 24 + 16 Mp, which allow you to create images with maximum resolution. With the 48MP camera, users can take up to 30 frames per second with zero shutter delay or use super slow-motion mode in HD with a frame rate of 480FPS to capture important points. MediaTek provides high resolution thanks to triple to the processor image processing (ISP). It allows you to take RAW (14 bits) or YUV (10 bits) snapshots. An image processing processor designed for the use of AI in cameras allows you to qualitatively recognize faces and scenes in real time in low light and in motion.

The double VoLTE 4G module LTE WorldMode с fast Cat-12 (DL)/Cat-13 (UL) 4G the LTE modem is integrated into Helio P90. 4x4 MIMO and 256QAM allow for high channel capacity even in densely populated areas, the MediaTek noted. The chipset also supports 2x2 802.11ac and Bluetooth 5.0 standards.

The appearance of Helio P90 in user devices is expected in the first quarter of 2019.

Helio P70

On October 25, 2018, the company MediaTek announced the launch of the Helio P70 chip (SoC) system with support for advanced AI technologies and upgraded central (CPU) and graphics (GPU) processors for more productive AI.

According to MediaTek, the launch of the Helio P70 was a continuation of the entry into the Helio P60 market. The P70 optimizes the flagship functions of the previous chipset, which will help expand the market smartphones with premium capabilities, while being affordable, the developer believes. Developed using 12nm FinFET TSMC technology, the Helio P70 supports a multi-core data processing unit artificial intelligence(APU) with a clock frequency of up to 525 MHz for fast and efficient AI technologies. To increase resource-intensive performance, games the chipset combines four ARM Cortex-A73 2.1 GHz processors and four ARM Cortex-A53 2.0 GHz processors in an octa-core big configuration. LITTLE. To increase power, the P70 also supports the RAM-G72 MP3 with a clock frequency of up to 900 MHz, which provides 13% higher performance than the Helio P60.

According to the developer, Helio P70 AI technologies provide 10% -30% faster data processing than the Helio P60. This means that the Helio P70 is capable of supporting more complex AI-based functions - for example, recognizing a person's pose in real time and encoding video information using AI. The AI-based video encoder MediaTek improves the quality of video calls even with limited network bandwidth. This feature can be used for video calls on Skype and Facebook, as well as for live broadcasts on YouTube.

Helio P70 is designed on the MediaTek NeuroPilot platform, an integrated ecosystem of hardware and software for the operation of advanced AI technologies. NeuroPilot supports common AI toolkits, including TensorFlow, TF Lite, Caffe, Caffe2 and specialized third-party solutions, the MediaTek noted.

According to the developer, the capabilities of the Helio P70 graphics processor allow you to ensure good gaming performance. It is optimized to reduce frame rate deviations and delay in touch control, as well as better display the visual series and get fast and smooth gameplay.

The Helio P70 supports a range of AI-based image and video capabilities, including real-time buoyancy, scene recognition, and augmented reality (AR) technology. According to the developer, the chipset provides deep-learning facial recognition with an accuracy of 90%. Hardware support for a single 32 Mp camera or dual 24 + 16 Mp camera gives device manufacturers functional flexibility. Three image processing processors (ISPs) save energy, reducing its consumption by 18% compared to the previous generation of Helio chipsets with dual camera module support.

The Helio P70 integrates a 4G LTE modem with a download speed of 300 Mbps. Dual 4G VoLTE module support provides seamless connection of two SIM cards for higher call quality and fast connection. The Helio P70 also supports smart antenna technology MediaTek, which automatically uses the optimal combination of antennas to maintain signal quality, the MediaTek emphasized.

As of October 2018, the Helio P70 is already at the stage of mass production. It is expected that the first devices based on the chipset will appear on the market by November 2018.

Helio A22

The MediaTek company presented on July 18, 2018 a series of chipsets Helio A. Thanks to the quad-core processor, functions of the camera, opportunities of AI technologies and high energy efficiency the Helio A series is optimized under the market of smartphones with support of the advanced functions, democratic at the price. The first chipset from the Helio A series was the system on the Helio A22 crystal (SoC).

MediaTek introduced the Helio A chipset series for mid-price smartphones

The Helio A series corresponds to our vision of the market for affordable mobile devices, where innovative features are presented not only in premium smartphones. With the Helio A22, manufacturers can bring innovative devices to the market that provide consumers with unprecedented features for the mid-market - high performance, long battery life, high photo quality and the benefits of AI technologies, said TL Lee, general manager of the MediaTek wireless division.

MediaTek Helio A22 is designed using the advanced 12nm technology FinFET TSMC, which enables devices based on it to provide high performance and energy efficiency. Equipped with MediaTek CorePilot technology, the chipset optimizes energy for each individual task to extend battery life. Helio A22 AI functions take advantage of the capabilities of the Development Tools Kit (SDK) MediaTek NeuroPilot and third-party applications based on artificial intelligence technologies.

SoC MediaTek Helio A22

Thanks to the Helio A22 MediaTek, devices get extensive camera and shooting capabilities using AI technologies. The chipset provides support for two 13 + 8 Mp cameras with a frequency of 30 frames per second (FPS) and a single camera - up to 21 Mp. 20:9 HD + display support allows manufacturers to create devices with a large screen.

The chipset supports the latest AI toolkits, including Google Android Neural Networks (API Android NNAPI), which will allow developers to easily create applications for smartphones the Helio A22.

The key element of the Helio A22, along with the innovative radio frequency device for collaboration Bluetooth and, Wi-Fi is communication capabilities. So, the chipset supports 4G LTE Cat-4 and Cat-7 standards for high-speed - Internet connection, as well as two 4G SIM cards with support for VoLTE and ViLTE technologies. The A22 also allows you to embed LPDDR3 RAM or faster LPDDR4 to create devices for different clients.

According to MediaTek, the GNSS extensions in the Helio A22 allow you to accelerate the time of the first location determination (TTFF) by 57%, increase the accuracy of determination by 10%, and also use up to 24% less energy compared to last generation chipsets. Thanks to the WiFi 802.11ac MediaTek standard, the Helio A22 has high throughput and information processing speed. The chipset also supports the BT5.0 standard, which allows you to increase the distance and speed of signal transmission, which is also suitable for smart home devices.

As of July 18, the Helio A series is at the stage of mass production. The first Xiaomi Redmi 6A based on the Helio A22 has already been sold in the Chinese market.

Helio P22

On May 23, 2018, MediaTek introduced the Helio P22, a chipset from Helio's series of powerful and energy-efficient mid-price smartphone solutions.

"Helio generation chipsets, in particular the P60, have generated a lot of interest in a market that has exceeded our expectations. At the same time, we see that demand among buyers is only growing. Clearly, consumers want innovative devices with superior features at an affordable price. With support for high-quality dual camera, AI-based capabilities, and incredible energy efficiency, the Helio P22 sets a new bar in the availability of premium features. "

Helio P22

Developed using the 12nm technology FinFET TSMC, MediaTek Helio P22 combines the most energy-efficient process on smartphones Android with MediaTek CorePilot technology. The octa-core processor Arm Cortex A53, up to 2.0 GHz, delivers sustainable, high-performance CPU while consuming less power.

P22 supports a common set of AI tools: TensorFlow, TF Lite, Caffe and Caffe2. New camera capabilities enabled by AI technologies include facial recognition, creation of smart photo albums, as well as support for the depth of sharpness function for single and double cameras. The Helio P22 provides hardware support for two 13 + 8 Mp cameras at 30 frames per second ( FPS).

With low resource costs and high-performance hardware capabilities that allow you to see a preview of the bokeh effect in real time, the chipset allows you to minimize graininess, noise, distortion, chromatic aberration and not only. All this makes it possible to create clear and clean images under different lighting conditions. Advanced 3A hardware (AE/AF/AWB) and MediaTek Camera Control Unit (CCU) with a high speed of automatic exposure installation allow users to get high-quality images of objects in motion. In addition, 20:9 HD + (1600 x 720) display support allows you to develop beautiful full-screen smartphones.

Users can enjoy LTE the connection on both - SIM cards and 802.11ac standard WiFi for a high-quality Internet connection. MediaTek Helio P22 also supports BT5.0, the wireless communication standard version, and the Bluetooth GNSS satellite system.

Helio P22 is now in mass production. It is expected that devices based on P22 will appear on the market by the end of the second quarter of 2018.

Helio P60

On February 26, 2018 the company MediaTek presented a system on a crystal (SoC) MediaTek Helio P60 - SoC the platform with the multicore block of processing of data connected with artificial intelligence(mobile APU) and technology of artificial intelligence MediaTek NeuroPilot. The combination of processors Arm the Cortex A73 and A53 increases CPU performance by 70% compared to previous Helio P23 and Helio P30 chipsets, and also increases GPU efficiency by 70%. Thanks to 12-nanometer FinFET technology the chipset of MediaTek Helio P60 allows to provide the high level of energy saving that significantly prolongs operating time of the accumulator.

Helio P60

"Combining core processing power and high performance with a data processing unit specifically designed to work with artificial intelligence applications, the MediaTek Helio P60 chipset provides consumers with flagship features. For example, deep learning-based recognition of faces, objects, and scenes, as well as improved camera features. Thus, the chipset gives everyone access to great devices, while being affordable. "

The MediaTek Helio P60 chipset uses the big octa-core architecture. LITTLE with four 2.0 GHz Arm A73 processors and four 2.0 GHz Arm A53 processors. The on-chip system is made using the 12nm TSMC FinFet technology. This is the most energy efficient MediaTek system in the P-series. Compared to the previous generation of P-series chipsets, the Helio P23, MediaTek Helio P60 is 12% more efficient overall and saves 25% more energy during resource-intensive games, allowing users to play them much longer. The chipset is controlled by MediaTek CorePilot 4.0 technology, which includes thermal control, user monitoring and Energy Aware Scheduling (EAS) technology. This allows you to optimize the allocation of resources between processor operation and energy conservation. So, MediaTek Helio P60 provides a single, stable user interface even for the most demanding computing tasks of artificial intelligence. MediaTek Helio P60 allows you to integrate AI technology NeuroPilot in the most. heart smartphone Its computational architecture for implementing artificial intelligence tasks works simultaneously on a central and graphical processor, as well as a mobile processing unit inside the system on a chip, in order to maximize its performance and energy saving. With twice the power efficiency of the graphics processor, the multi-core processing unit (AI APU) MediaTek Helio P60 provides a high level of energy saving for sustainable chipset use and high performance - 280 GMAC/s.

MediaTek NeuroPilot SDK in the Helio P60 chipset is compatible Google Android with Neural Networks (API Android NNAPI), and also supports common sets of tools for AI, including TF TensorFlow Lite, Caffe and Caffe2. This makes it easier for developers to bring innovative applications based on artificial intelligence to the market. As a partner of the Open Neural Network Exchange (ONNX), MediaTek is working to ensure that the chipset receives support for the ONNX format in the second quarter of 2018. This will give developers greater flexibility in building AI applications.

Compared to previous models of the Helio P series, the MediaTek Helio P60 is equipped with three image processing processors (ISP), which allows you to increase performance and reduce energy consumption when using two cameras by 18%. The combination of cameras supported by the Helio P60 with a powerful mobile processing unit will allow users to enjoy the capabilities of artificial intelligence in applications. For example, by bewitching, overlaying layers, and previewing video in real time, supporting augmented and mixed reality, enhanced photo capabilities, and more.

The MediaTek Helio P60 integrates a 4G LTE modem of class WorldMode. The chipset also supports two 4G VoLTE modules and TAS 2.0 smart antenna technology to provide consumers with seamless communications anywhere in the world. Thanks to the balance of power and performance, the MediaTek Helio P60 chipset will allow smartphone manufacturers to market more advanced, functional and reliable smartphones in the middle price segment.

Smartphones based on the MediaTek Helio P60 chipset will be available worldwide from the beginning of the second quarter of 2018.

2017: Helio P23 и Helio P30

In August 2017, MediaTek Inc. announced representatives of the Helio, Helio P23 and Helio P30 family. Chipsets designed to provide high performance and energy efficiency, support the functions of dual cameras, two SIM cards and VoLTE, will introduce innovations in the average price segment.

Dual Camera Support

The P23 and P30 support the dual camera feature of the device, which guarantees excellent photo quality. MediaTek Helio P23 supports a combination of 13 + 13 megapixels, and MediaTek Helio P30 - up to 16 + 16 megapixels. They also support single cell modes of up to 24 and 25 megapixels, respectively.

Chipsets are equipped with a set of Imagiq 2.0 technologies from MediaTek to minimize graininess and noise, reduce chromatic aberration and improve the image in a number of adverse lighting conditions. In addition, the new hardware camera control unit (CCU) provides fast focus correction and exposure correction - at a convergence rate twice as fast as competitors - so that users never miss the moment they want to capture.

The P30 is also equipped with an image processing processor (VPU), a specialized 500 MHz digital signal processor connected to Image Signal processors, which frees up system resources and provides a number of key benefits, including:

• Programmability and flexibility: The VPU is built on a platform that allows equipment manufacturers to customize the camera functionality and thus differentiate the product. Many partners have already started using the VPU platform, including Almalence, ArcSoft, Core Photonics, OT-Morpho, Sensory and Itseez.
• Reduced power consumption: The VPU is a dedicated hardware unit. It performs real-time processing functions, which are usually assigned to a processor or graphics processor, but on a tenth of the power consumed by conventional processors.
• Performance improvement: VPU can be used alone or in an alliance with CPU/GPU. This provides a true heterogeneous computing environment in the same memory subsystem to extend multitasking.

Dual 4G Support VoLTE

MediaTek Helio P23 offers the world's first dual SIM dual 4G VoLTE/ ViLTE support. This provides even faster and more reliable communication for users who use two SIM cards. The P23 and P30 are equipped with the latest generation 4G LTE WorldMode modem from MediaTek, providing excellent energy efficiency and performance, with a unique combination of Cat-7/13 speeds when loading 300 Mbps and loading 150 Mbps. TAS 2.0 smart antenna technology further improves performance and convenience using the best combination of antennas to ensure optimal signal quality.

Performance with CorePilot from MediaTek technology

Using CorePilot technology from MediaTek, the P23 and P30 run on eight Cortex-A53 cores at speeds up to 2.3 GHz, providing high performance and unprecedented user experience. Both chipsets are equipped with a new Mali G71 MP2 graphics processor running at 770 MHz in P23 and 950 MHz in P30, providing high graphics performance.

CorePilot 4.0 technology from MediaTek with intelligent power management, temperature control, and UX monitoring provides stable, high-performance, and reliable operation for all cores. The P23 and P30 provide all this without sacrificing battery life.

Multimedia Content Processing

The Helio P23 and Helio P30 integrate a multimedia processor designed to decode H.265 (HEVC) 4K x 2K video at 30 frames per second for low-power playback according to the latest video encoding standard used by numerous providers. This solution significantly extends the battery life.