RSS
Логотип
Баннер в шапке 1
Баннер в шапке 2

Lasers and Instrumentation: Laser Marking and Wafer Micro-Processing Plant

Product
Developers: Lasers and equipment
Date of the premiere of the system: 2022/12/14
Last Release Date: 2022/12/14
Branches: Electrical and Microelectronics

2022: Presentation of the installation for marking products of the microelectronic industry

Specialists of the capital company "Lasers and Equipment" have developed a device for laser marking and micromachining of semiconductor plates, which serve as the basis for the creation of microcircuits. This was announced on December 14, 2022 by the head of the Department of Investment and Industrial Policy of Moscow, which is part of the Complex of Economic Policy and Property and Land Relations of the capital, Vladislav Ovchinsky.

File:Aquote1.png
"To identify semiconductor wafers during production, special markings are applied to their surface. It also confirms the reliability of the product and allows you to sort the defective product more carefully. The specialists of the company "Lasers and Equipment" have developed an installation for marking plates, which is equipped with a system for automatic loading of the product into the processing zone. This solution will be relevant for the production of microelectronics. In an hour, a laser installation can process more than 100 semiconductor plates made of silicon, silicon carbide, gallium arsenide and gallium phosphide, "said Vladislav Ovchinsky.
File:Aquote2.png

Loading and unloading into the marking area is carried out using a pneumatic robot-reloader, which eliminates mechanical damage to the products. The positioning and fixation of the plate takes place automatically without touching the surface of the desktop, and the return of the processed product to the robot-reloader takes place due to air sampling.

The software module for controlling overload and marking of products, developed by the specialists of the company "Lasers and Equipment," allows you to automatically recalculate the number of plates in the supply and receiving cassettes, set the technological parameters of the marking, and control the laser operation modes.

File:Aquote1.png
"This installation allows you to take the wafer processing process in terms of laser technologies to a new level by automating the process, as well as reducing the number of defective products. At the same time, the components and software here are Russian, "said Anna Tsygantsova, executive director of the Lasers and Equipment group of companies.
File:Aquote2.png