History
2021: Raising $3.5 billion to eliminate chip shortages
At the end of April 2021, Intel announced its intention to invest $3.5 billion in the Rio Rancho plant in New Mexico to eliminate chip shortages and deploy work with the spatial layout of Foveros.
The upgrade of Intel New Mexico, in partnership with the Government of New Mexico and local authorities, is expected to provide 1,000 new jobs over a three-year period of construction, as well as 700 permanent high-skilled jobs in the company and 3,500 support positions in the area when the facility is fully operational. Indirectly, this project will provide work for at least 3,500 residents of the state.
The expanded enterprise will not produce silicon wafers or chips, but instead will take already manufactured chips (manufactured at Intel plants or other enterprises such as TSMC) and assemble them into a single package, which will then be sold to partners. This facility will focus on working with Intel's new 3D packaging technology, also known as Foveros.
Foveros is a packaging technology that allows you to connect two chips together. Intel has already engaged Foveros in the creation of processors for a laptop called Lakefield, as well as in the production of high-performance computing processors Ponte Vecchio, combining in one product more than forty crystals and one hundred billion transistors to be used in. supercomputer Aurora Expanding production capacity in Rio Rancho, Intel intends to bring advanced packaging technologies such as Foveros to production of a wider scale.
The construction of a new plant should begin at the end of 2021, and new workshops will be launched by the end of 2022.[1]