Chip manufacturing equipment (Russian market)

Semiconductors (Russian market)

Main article: Semiconductors (Russian market)

2026

Russia has developed a laser-plasma X-ray lithograph for the production of microelectronics

In February 2026, at the Institute of Microstructure Physics of the Russian Academy of Sciences (branch of the Russian Academy of Sciences named after A.V. Gaponov-Grekhov), an experimental stand was presented, which is a prototype of a laser-plasma source for a new generation industrial X-ray lithograph. The plant operates at a wavelength of 11.2 nm and is designed to develop key technological solutions. Read more here.

The Ministry of Industry and Trade signed a contract with Micron worth 1.56 billion rubles for the development of equipment for the production of chips

The Ministry of Industry and Trade of the Russian Federation signed a contract worth 1.56 billion rubles with the Mikron Zelenograd plant (part of the Element microelectronic group) for the development of an automated installation for the production of chips. Information on the conclusion of the contract, published on the public procurement portal, was published on February 26, 2026. Read more here.

In Russia, for 5 billion rubles, they create X-ray lithography technology for the production of electronics

In Russia, a project is being developed to create an experimental station for X-ray lithography "ORYeL-7" (Experimental REntgenovsky Lithograph). The project cost estimate is 4.5-5 billion rubles. This was announced by the head of the laboratory of the Institute of Semiconductor Physics of the SB RAS Dmitry Shcheglov on February 18, 2026. Read more here.

In Russia, the production of 350-nm lithographs for the production of chips has begun. They cost 392 million rubles

In February 2026, it became known that the base price of the domestic 350-nm lithograph Progress STP-350, which includes delivery, installation and training of personnel, is about 392 million rubles without VAT. With an extended guarantee, the price of the system exceeds 500 million rubles. Read more here.

2025

A device for innovative laser welding of glass has been released in Russia. It will help in the production of chips

The Russian company VPG LaserONE has created a device for innovative laser welding of glass. The technology allows you to connect glass to glass and metals without using adhesive materials. The method will find application in microelectronics, instrumentation, microfluidics and medical devices. The company told about this in December 2025. Read more here.

GC "Element" has developed the first equipment in Russia for the production of 65-nm chips

In December 2025, Element Group of Companies announced the development and assembly of the first cluster systems in Russia for plasma chemical deposition and etching processes. Plants can be used as part of production lines for the production of integrated circuits according to topological standards of 65 nm on plates with diameters of 200 mm and 300 mm. Russian organizations are among the five companies in the world with competencies in the development and production of this class of technological equipment. Read more here

The Ministry of Industry and Trade allocated ₽54,5 billion to centers for the introduction of equipment and materials for microelectronics

The Russian government has allocated ₽54,5 billion to create centers for the introduction of equipment and materials for microelectronics. Centers will appear in Zelenograd by 2028 and in St. Petersburg by 2027. This was reported by CNews at the end of November 2025.

We are talking about two centers in Zelenograd and one center in St. Petersburg. The financing is aimed at creating an infrastructure to bring to the level of serial production the results of development work in the areas of domestic equipment and materials for the production of microelectronics.

Ministry of Industry and Trade invests ₽54,5 billion in import substitution of microelectronics

From the presentation of the Ministry of Industry and Trade it follows that ₽50 billion were allocated for the creation of the "Base Center." Its area will be 9 thousand square meters. m. The center will work with microelectronics and power electronics using 250-90 nanometers technology on 200 mm plates. The commissioning of the center is scheduled for 2028.

The second center called "Starter" will work on the basis of the National Research University "Moscow Institute of Electronic Technology" also in Zelenograd. ₽4,5 billion was allocated for it, follows from the document of the ministry. The center will work in the areas of power electronics and microelectronics on plates with a diameter of 100-150 mm in topology of more than 180 nanometers. Its area will be 3 thousand square meters. m. Commissioning is scheduled for 2028.

Another microwave electronics center is planned to be opened on the basis of the Ioffe Institute of Physics and Technology in St. Petersburg. There are no investments for the project. The center will work with 100-150 mm plates in topology over 350 nanometers. Its area will be 0.5 thousand square meters. m. Commissioning is planned in 2027.

On the basis of such centers, it is planned to bring to the level of serial production the results of development work in the areas of domestic equipment and materials for the production of microelectronics. The author of the Telegram channel RUSmicro Aleksei Boyko explained that when it comes to a landfill or laboratory, we mean a test production line, within which you can check the operation of individual line components, develop or check technological processes.^[1]

The Ministry of Industry and Trade allocated ₽6,8 billion for the development of equipment for the production of chips

The Ministry of Industry and Trade has allocated over ₽6,8 billion for the development of equipment for the production of microelectronics in the country. We are talking about five tenders that were published on the public procurement portal on November 25, 2025.

According to CNews, the department allocated the largest amount of five tenders - ₽1,99 billion - for the development of an industrially oriented cluster complex for applying aluminum metallization layers by vacuum spraying. The unit will have to work with plates with a diameter of 200 mm using 180-90 nanometers technology. The work must be completed by September 30, 2030.

The Ministry of Industry and Trade allocated 6.8 billion rubles to create equipment for the manufacture of microcircuits

An analogue of such equipment is the American Applied Materials 0230-70040 Endura HP PVD and the Swiss Evatec Clusterline 300. The development of a domestic installation will reduce dependence on imported equipment for the production of microelectronics.

The Ministry of Industry and Trade allocated another ₽1,61 billion for the development of an automated plant for measuring the spacing of topological layers on silicon wafers with a diameter of 150 and 200 mm. Its analogue is the American ARCHER 10 XT produced by KLA TENCOR. The work should be completed on July 31, 2029.

The ministry has allocated funds for two furnaces and annealing plants. The Ministry of Industry and Trade allocated ₽1,52 billion for the development and manufacture of prototypes of vertical diffusion furnaces for high-temperature processing of silicon wafers up to 200 mm. The installation is needed for group atmospheric wet oxidation in water vapors, annealing, chemical deposition of dielectric and polysilicon layers.

The plant will provide basic technological processes of products with norms of 180-90 nm. Its counterpart is the Japanese TELALPHA. The work must be completed by October 31, 2029. The development of a domestic installation will allow replacing Japanese equipment at Russian enterprises.^[2]

The Ministry of Industry and Trade approved a point system for assessing the localization of equipment for the production of chips

November 5, 2025 Ministry of Industry and Trade Russia approved a point system to assess the level of localization of equipment for the production of semiconductor chips. The innovation is aimed at implementing the strategy for the development of the electronic industry of the Russian Federation for the period up to 2030.

In accordance with the new system, 20 points will be awarded for the development of the basic technological process. The use of Russian components, depending on their type, will bring from 10 to 30 points (for each component). Another 30 points are provided for the use of domestic software (upper level, lower level, etc.).

The Ministry of Industry and Trade has introduced a system for assessing the level of localization of equipment for the manufacture of microcircuits through the accrual of points

The requirements for classifying equipment as Russian industrial products will increase by year. Points are planned to be awarded for products of eight categories, and the minimum values ​ ​ are determined at the following level:

• Equipment for epitaxial growth of semiconductor structures: from January 1, 2026 to December 31, 2028 - at least 130 points, from January 1, 2029 to December 31, 2031 - at least 190 points, from January 1, 2032 - at least 250 points;
• Chemical and lithographic equipment for processing semiconductor plates and forming a topological pattern: 80, 160 and 170 points for the specified years, respectively;
• Equipment for ion implantation of impurities into semiconductor plates: 40, 180 and 210 points;
• Equipment for the production of semiconductor ingots (bools): 90, 140 and 210 points;
• Equipment for thermal treatment of plates, including the processes of oxidation of plates, chemical deposition of coatings from the gas phase on plates, diffusion of impurities in plates: 80, 150 and 170 points;
• Equipment for the formation of thin-film structures of semiconductor devices: 90, 230 and 250 points;
• Laser equipment for processing semiconductor plates: 70, 140 and 160 points;
• Polishing and polishing equipment for semiconductor wafers: 90, 160 and 210 points.^[3]

The Ministry of Industry and Trade revealed the scheme according to which equipment for the production of chips will be recognized as Russian

In early October 2025 Ministry of Industry and Trade RUSSIAN FEDERATION , he revealed a scheme for calculating points that must be collected by equipment for the production of chips for its inclusion in the register of Russian industrial products. Getting on this list gives companies preferences in the framework of state purchases and receiving subsidies.

We are talking about equipment for crystal production. According to CNews, referring to information received from representatives of the Ministry of Industry and Trade, since 2026, suppliers of such installations will need to score at least 130 points to be included in the register of domestic products. In particular, 30 points will be awarded for the use of Russian vacuum chambers, mechanisms for loading and unloading plates, for the substrate heating unit, as well as for compatibility with Russian process control systems. The use of domestic user and service software can also bring up to 30 points. In general, at the maximum level of use of Russian components, 380 points can be awarded.

The Ministry of Industry and Trade presented criteria according to which equipment for the production of chips will belong to the Russian

The Ministry of Industry and Trade also reported that the threshold for entering the register is planned to be gradually increased. So, in 2029 it will be 190 points. In 2032, you will have to get at least 270 points to be included in the list. In addition, a number of requirements are imposed on equipment suppliers themselves: the company must be a tax resident, not under the control of foreign structures, have a service center in Russia, etc.

According to Yakov Petrenko, head of the electronic engineering department of ISTC MIET, the point system will be adopted by the end of 2025. In the future, a similar mechanism is planned for equipment for the production of printed circuit boards, housing and installation.^[4]

Delay in the development of Russian equipment for the production of "mature" chips for a year

At the end of September 2025, Anton Isaev, deputy general director of the ISTC MIET, said that the development of some types of equipment for the production of chips is lagging behind the deadlines approved by the state program "Electronic Engineering." First of all, we are talking about systems for the production of semiconductors based on "mature" technical processes.

According to Isaev, the timing of the development of equipment is shifting due to several reasons, among which are technological unavailability for individual developments (lack of potential performers), a shortage of personnel and funding.

The development of Russian equipment for the production of "mature" chips has been postponed for a year

Most of our specialized companies are critically overloaded today, which is why we have to shift plans to stage work to the right, "said a representative of ISTC MIET, whose words are quoted by CNews.

According to Anton Isaev, in conditions of lack of budgets, market participants should act focused and focus on providing equipment for more mature technological lines.

Perhaps we need to pause in the development of promising equipment under 300 millimeters and focus on the simplest and most efficient installations, - said the deputy general director of ISTC MIET.

He expressed his opinion on the need to develop scenarios for the development of the industry, which would vary depending on the amount of state funding. Isaev stressed that the achievement of targets and the transition to stable serial production of the entire complex of equipment is impossible without comprehensive state support.

The ISTC representative of MIET also pointed out the imbalance in support measures, which is currently biased towards the development of equipment, without stimulating its serial production and consumer demand. As a solution, he proposed directing investments in the development of production facilities. According to him, obtaining preferential loans from the Industrial Development Fund with the condition of partial repayment of their principal amount could be an effective tool.^[5]

The first Russian lithograph with a resolution of 350 nm for the production of chips has been released

Zelenograd Nanotechnology Center has completed the production of the first domestic lithograph with a resolution of 350 nanometers, designed for the manufacture of semiconductor chips at Russian microelectronic enterprises. The equipment is supplied to the company "Industry Solutions," which is part of the contour of the "Element" group and specializes in the production of power electronics for the power, engineering and aviation industries. The start of deliveries of the first Russian lithographic equipment became known on September 24, 2025. Read more here

Mass production of equipment for mounting printed circuit boards launched in Russia

The Russian company Expert Group has launched mass production of an automatic installer of SMD components PiPlacer8 for assembling printed circuit boards with a capacity of 15 thousand components per hour. The equipment was created with the support of the Skolkovo Foundation and the Ministry of Industry and Trade Russia as part of the program to support small design centers. " Microelectronics The launch of production took place in early July 2025. More. here

Zelenograd Nanotechnology Center presented the first Russian lithographer

At the end of April 2025, the Zelenograd Nanotechnology Center (ZNTC) announced the completion of development work on the creation of the first domestic photolithograph with a resolution of 350 nanometers, which is a key element in the production of microcircuits. The installation of combination and projection exposure has already been adopted by the state commission, which included representatives of industry organizations and the largest Russian manufacturers of microelectronics. Read more here.

An innovative lithograph working on the principle of a 3D printer has been developed in Russia

Scientists at the Moscow Institute of Physics and Technology (MIPT) have developed a unique domestic lithograph capable of creating three-dimensional microstructures with element sizes up to 150 nm and a resolution of 350 nanometers. This was reported by the press service of the institute in April 2025. Innovative equipment operates on the principle of a 3D printer, which significantly expands its functionality. Read more here

The first Russian installation for plasma chemical deposition on 300 mm silicon wafers is presented

The first Russian installation for plasma chemical deposition on 300-mm silicon plates was presented in March 2025. The development was carried out by the Research Institute of Precision Engineering (NIITM), which is part of the Element Group of Companies. Before the advent of this equipment, there were no analogues on the Russian market for working with plates of this diameter, and the entire production base was focused on imported solutions or installations designed for 200-mm substrates. Read more here.

In Russia, the production of machines for micro-processing and high-precision metal cutting in the manufacture of chips has been launched. VIDEO

The production of high-precision equipment for micro-processing of metal was launched in Russia in 2025. Localization of the assembly of Aeromacht laser machines was started by GK Equipment Technologies LLC. The new capacity is designed to make microelectronics components, including chips. Production aims to reduce imports and strengthen the national technology sector. This became known on February 18, 2025. Read more here.

2024

Revenue of Russian manufacturers of equipment for the production of chips for the year increased by 62% and reached ₽17 billion

The total revenue of Russian companies in the field of electronic engineering reached ₽17 billion in 2024, an increase of 62% compared to ₽10,5 billion in 2023. The volume of production of equipment for the creation of microelectronics amounted to ₽5,1 billion in 2024 against ₽3,5 billion a year earlier. This became known on September 10, 2025.

According to CNews, statistics cover the 25 largest organizations engaged in the development and production of products in the field of electronic engineering. ISTC experts predict further revenue growth to ₽20 billion by the end of 2025, and production can reach ₽6,5 billion.

Revenue of Russian manufacturers of equipment for the production of chips for the year increased by 62%

The dynamics of the industry demonstrates multiple growth over a three-year period. In 2022, revenue was ₽5,7 billion, which means a threefold increase by 2024. The volume of production showed even more impressive dynamics - an increase of four times from ₽1,2 billion in 2022 to ₽5,1 billion in 2024.

The head of the electronic engineering department of ISTC MIET Yakov Petrenko explained the growth by expanding the product range and improving the quality of Russian equipment. According to him, domestic solutions are becoming more competitive with foreign counterparts.

Petrenko noted the importance of service, which is not available for imported equipment, while Russian enterprises have formed service teams and provide warranty service for their products. This creates additional competitive advantages for domestic manufacturers.

Leading companies in the industry include NIITM JSC from Zelenograd, NTO JSC from St. Petersburg, NIIPM JSC from Voronezh and Sovtest ATE LLC from Kursk. These enterprises form the basis of Russian electronic engineering and determine the pace of development of the industry.^[6]

The Ministry of Industry and Trade allocated ₽300 million for the creation of Russian equipment for the production of chips

Ministry of Industry and Trade Russia On January 30, 2025, it announced the allocation of ₽300 million to check the effectiveness of state subsidies to enterprises developing equipment for the production of microelectronics, with the completion of work by December 2026.

According to CNews, the project provides for an analysis of the actual costs of development work and field inspections to assess the achievement of the results of the provision of subsidies. The contractor of the project will be determined on February 18, 2025.

The Ministry of Industry and Trade allocated 300 million rubles for the development of domestic equipment for the production of microcircuits

Head of the Department of Electronic Engineering ISTC MIET Yakov Petrenko said that the program for the development of electronic engineering provides for import substitution of about 70% of equipment and materials for the production of microelectronics by 2030 through the implementation of 110 development work.

Within the framework of the program, it is planned to develop domestic equipment for 20 technological routes, including microelectronics with topological norms from 180 to 28 nanometers, microwave electronics, photonics and power electronics.

By 2026, it is planned to master epitaxy technology for growing multilayer semiconductor structures. In total, 15 types of instrumentation, 13 types of plasma chemical installations and 10 plants for lithography will be created.

According to the Ministry of Industry and Trade, the program provides for budget financing of more than ₽240 billion until 2030. More than 50 organizations are participating in the implementation of the program, while 67 development work has already been launched, and in 2025-2026 it is planned to start another 43.

Russia uses at least 400 models of equipment for the production of microelectronics, of which only 12% can be produced in the country. The group of companies Element"" through LLC Nanotronics"" has already begun the development and production of a line of equipment for the production of radio, SVC and microelectronics.

The need to create its own equipment escalated after March 2022, when difficulties arose with the purchase and import of foreign equipment for the production of microelectronics.^[7]

Creation of the first Russian installation for the production of semiconductor crystals for industrial electronics

Specialists of NIITM JSC, NTC Microelectronics RAS and Soft-Impact LLC developed and tested the first domestic industrial plant for growing gallium nitride crystals on silicon substrates in December 2024. Russia has become the fourth country in the world to master the production of equipment of this class. Read more here

Allocation of ₽1,1 billion for the development of lasers for the production of chips and 3D printing

In early December 2024, the Ministry of Industry and Trade of Russia launched a program to create manufacturing technologies and organize pilot production of materials for Russian lasers necessary for the production of microchips. ₽1,1 billion has been allocated for the implementation of the project, the completion of work is scheduled for December 1, 2026.

According to CNews, the project provides for the development of quantum-sized heteroepitaxial structures based on domestic crystals and substrates of gallium arsenide for diode lasers. The materials being developed are designed for pumping systems of powerful lasers, equipment for laser processing of metals, additive production and medical equipment.

The Ministry of Industry and Trade allocated ₽1,1 billion for the development of lasers for the production of chips and 3D printing

The technology involves the creation of structures using a single crystal substrate of gallium arsenide and layers of solid solutions of semiconductor compounds grown by molecular beam epitaxy based on the In Ga-As and Al-Ga-As system. The project is being implemented within the framework of the state program for the development of the electronic and radio-electronic industry.

Deputy Head of the Ministry of Industry and Trade Vasily Shpak noted that the production of Russian equipment for the production of chips with 350 nm topology will begin in 2024, and with 130 nm topology - in 2026. The development involves the Belarusian Planar and the Zelenograd Nanotechnology Center, which are creating a photolithograph for the manufacture of microcircuits.

The ministry is also working to create equipment for setting up domestic lithographs. "The development of our own production of components is necessary to increase the level of localization of developments and ensure technological independence," the press service of the department emphasized.

As part of the import substitution program, the production of helium-neon lasers and photodetectors for equipment positioning systems used in the production of integrated circuits with topological standards up to 65 nm is being developed and mastered. These kits are planned to be installed in the existing lithographic steppers and scanners Nikon of SF 204-206, i-11, i-12, ASML PAS-5500 series.^[8]

Mikhail Mishustin approved a list of equipment for the production of chips, the manufacturers of which will be given benefits from January 1

On December 2, 2024, Prime Minister Mikhail Mishustin approved a list of equipment for creating an electronic component base, the manufacturers of which will receive benefits. We are talking about a reduced premium rate of 7.6%. Read more here.

Allocation of 175 million rubles for the development of helium-neon lasers for the production of chips

On November 22, 2024, the Ministry of Industry and Trade announced a competition for the implementation of development work "Development and development of the production of helium-neon lasers and photodetectors for positioning systems for equipment used in the production of IC (integrated circuits) with topological standards up to 65 nm." 175 million rubles are allocated for the implementation of the project.

The designed equipment includes a helium-neon laser with a power supply unit and cable, as well as a photodetector. These products are designed to replace 5517C model lasers and photodetectors of E1709A models and 10780F manufactured by Keysight in foreign equipment, as well as in existing and developed domestic equipment, such as:

The Ministry of Industry and Trade allocated 175 million rubles for the development of helium-neon lasers for the production of chips

• Lithographic steppers and scanners Nikon of the SF 204-206, i-11, i-12, ASML series PAS-5500 series, as well as image generators of topological structures on photographic patterns;
• Metrological REM for monitoring critical dimensions (CD-SEM) Hitachi series 93xx, CG-4000, CG-5000, as well as optical installations for monitoring the coordinates of topological elements and critical dimensions of structures on photographic patterns;
• Defective control units on AMAT Compass semiconductor plates and topological pattern on photomabels;
• Installation of laser elimination of unacceptable defects on photographic patterns;
• Electron beam lithography units.

The terms of reference states that the design of the created laser and photodetector in terms of overall, installation and connection dimensions should provide interchangeability with similar Keysight products. It is emphasized that the components of the designed devices and materials should be of domestic production and ensure the absence of critical dependence on foreign suppliers.^[9]

The Ministry of Industry and Trade allocated ₽1,7 billion to create equipment for the production of silicon wafers

The Ministry of Industry and Trade of Russia announced the allocation of ₽1,7 billion for the development of a chemical-mechanical polishing plant for the production of silicon wafers with a diameter of 200 mm. This became known on November 22, 2024. The equipment is designed for the manufacture of chips with topological norms from 180 to 90 nanometers.

According to CNews, the new installation will become a domestic analogue of the American MIRRA Mesa Integrated System 200 manufactured by Applied Materials. The main consumers of the equipment are the Zelenograd enterprises Micron and NM-TECH.

Ministry of Industry and Trade allocated ₽1,7 billion for the creation of equipment for silicon wafers

The expert and author of the Telegram channel RUSmicro Aleksei Boyko notes that the development of a machine for chemical-mechanical polishing is part of a large-scale work to create a complex of domestic production equipment for the production of microcircuits.

The technical requirements provide for the use of exclusively domestic components and materials to ensure independence from foreign manufacturers. The plant will planarize the dielectric layer of silica and then wash the plate and measure the thickness of the layer.

The project is implemented within the framework of the state program of scientific and technological development of Russia. Completion of the development is scheduled for November 30, 2028, and the determination of the performer will take place on December 10, 2024.

This project is part of a comprehensive strategy for the development of electronic engineering in Russia. The ministry also invests in the development of the production of materials for the manufacture of chips and the creation of equipment for setting up domestic lithographs, for which an additional ₽400 million has been allocated. By 2027, it is planned to achieve the production of 100 thousand plates of doped single-crystal silicon.^[10]

The Ministry of Industry and Trade allocated ₽0,5 billion for equipment for setting up chip production systems

The Russian Ministry of Industry and Trade initiated in early November 2024 a competitive procedure for the creation of a high-precision measuring complex for calibrating lithographic systems with a budget of ₽497,1 million as part of the national technological development program.

According to CNews, the reference installation being developed will provide control over the characteristics of ultraviolet laser radiation when setting up and operating promising lithographic equipment. Completion of the technical project is scheduled for the second quarter of 2027.

The Ministry of Industry and Trade allocated almost 0.5 billion rubles for the purchase of equipment for the adjustment of chip production systems.

Head of the Department of Electronic Engineering ISTC MIET Yakov Petrenko explained the purpose of the developed complex as a tool for confirming the technical parameters of domestic sources of ultraviolet radiation in lithographic installations.

The technical project covers the development of measuring systems for the analysis of energy indicators and spatial characteristics of radiation at fixed wavelengths of 193 and 248 nanometers. The specification provides for the use of an exclusively domestic component base.

Deputy Minister of Industry and Trade Vasily Shpak announced the start of production of Russian lithographic complexes for the manufacture of microcircuits with topological standards of 350 nanometers in 2024 and 130 nanometers in 2026. Prototypes are tested at the facilities of the Belarusian Planar and the Zelenograd Nanotechnology Center.

Vera Smirnova, Executive Director of the AKRP-Consortium of Design Centers, noted the intensive development of the domestic laser industry. The electronic engineering modernization program includes the creation of fifteen types of specialized measuring equipment.

The priority area is the development of automated production control systems, including complexes for analyzing defects, impurities and accuracy of combining technological layers. Scientific support is carried out by specialized institutes of the Russian Academy of Sciences.^[11]

The Ministry of Industry and Trade is preparing 110 projects for the development of equipment for microelectronics for 240 billion rubles

At the end of September 2024, it became known that 110 design works will be implemented in Russia to create installations for the production of microelectronics. The corresponding program was developed by the Ministry of Industry and Trade of the Russian Federation together with the International Scientific and Technological Center (ISTC) MIET.

The newspaper told about the initiative. Sheets Work is planned to be carried out in four areas - process equipment, materials and chemicals, as well as computer-aided design systems (). CAD Budget funding until 2030 will amount to more than 240 billion. rubles As of October 2024, over 50 organizations are participating in the implementation of the program.

The Ministry of Industry and Trade is preparing 110 projects for the development of equipment for microelectronics

In total, it is planned to develop 15 types of instrumentation, 13 types of plasma chemical installations, 10 plants for lithography, nine for housing, eight each for the production of photographic patterns and epitaxy, seven for the manufacture of plates, etc. 20 technological routes have been identified, including microelectronics (from 180 to 28 nm), microwave electronics, photonics, power electronics, production of photographic patterns and assembly of electronic component base (ECB) and modules, production of passive electronics, etc.

According to estimates, by 2030, 70% of equipment and materials for the production of microelectronics will be imported in Russia. In particular, by the end of 2026, it is planned to master the preparation of plates: single crystals will be grown on Russian equipment, cut them, grind and polish, wash and dry, apply elements and control output products. By the same time, it is planned to create lithography with the UV range for the production of processors according to topological standards 350 nm and 130 nm. The development of a unit for electron beam lithography for 150 nm is being prepared. Plus, it is planned to master epitaxy - a process in which several layers of semiconductor materials are grown on one substrate. By 2030, it is expected to release a scanner for the production of chips according to 90-65 nm standards. ^[12]

Foreign equipment for the production of microelectronics in Russia has risen in price 10 times

Russian manufacturers of power electronics have faced a tenfold increase in prices for imported measuring equipment necessary to control the quality of their products. This became known in September 2024.

According to CNews, Maxim Kharchenko, deputy head of the development department of Voronezh Semiconductor Devices Assembly JSC, announced a significant increase in the cost of foreign analogues of high-precision measuring installations for power electronics. In addition to rising prices, the expert noted difficulties with the supply of such equipment to Russia.

Computer chip

The situation is complicated by the fact that high-accuracy installations for power electronics are not produced in Russia. This equipment is necessary for the output control of good products, including transistors, diodes and power modules.

the author of the Telegram channel Rusmicro Aleksei Boyko confirmed the presence of problems with measurements in the field of power electronics. He explained this by the need for precision measurements against the background of high voltages and currents. The expert also noted that Russian enterprises have to overpay for the purchase of foreign equipment through alternative supply channels.

Despite the current situation, there are companies in Russia that develop and produce measuring equipment. For example, LLC "FORM" produces separate instruments for measurements in power electronics. However, the nomenclature of domestic equipment is significantly inferior to the lines of global or specialized foreign manufacturers.

The problem is exacerbated by outdated standards in the production of power electronics. According to Maxim Kharchenko, the existing system of standards has not been updated for 35-50 years and does not meet modern product requirements.

Despite the difficulties, the production of power electronics is developing in Russia. Element is investing ₽20 billion in the production of power transistors and diodes, planning to provide up to 60% of demand in the country by 2030. In addition, MIET together with NIIET develop nitride-galium technology.^[13]

The Ministry of Industry and Trade allocated 500 million rubles for the development of equipment for the production of microelectronics to replace the Chinese

In September 2024 Ministry of Industry and Trade Russia , it allocated almost ₽500 million for the development of equipment for the production of microelectronics, which should replace similar equipment purchased in. We China are talking about the creation of a plant for washing and drying special SMIF containers used to store and move silicon wafers during their production. The equipment is designed to increase the level of purity in the production of semiconductors, which helps to reduce the number of defects and increase the yield of good products.

According to Cnews, the All-Russian Research Institute of Experimental Physics will develop this installation. Two and a half years are allotted for the work. The project provides for the processing of SMIF containers and cassettes for silicon wafers with a diameter of 150 mm and 200 mm. This equipment is in demand at enterprises such as Micron, Istok im. Shokin, NIIS im. Sedakov and NZPP Vostok. According to the Ministry of Industry and Trade, by 2030 the need for such installations in Russia will be at least 10 units.

The Ministry of Industry and Trade allocated 500 million rubles for the development of equipment to replace Chinese microelectronics

At the moment, such installations are being purchased in China, which makes their replacement an important part of the import substitution program. The representative of the Ministry of Industry and Trade explained that SMIF containers provide a high level of cleanliness on production lines and help significantly reduce the likelihood of defects when working with semiconductor plates. To maintain this level of cleanliness, special installations are required for cleaning containers that will be produced in Russia using domestic components.

Since the introduction of sanctions against Russia in 2022, the country has been actively working on the development of its own microelectronic industry. In particular, at the end of August 2024, a project was announced to create standards for manufacturers of electronic equipment. In addition, the group, "Item" which through LLC "Nanotronics" is developing equipment for the production of radio, SVC and microelectronics, has already invested several billion rubles in the development of this industry.^[14]

The Ministry of Industry and Trade allocated 300 million rubles for the development of equipment for the production of silicon wafers

The Ministry of Industry and Trade of Russia (Ministry of Industry and Trade) in September 2024 announced the allocation of ₽300 million for the development of new equipment intended for the production of silicon wafers. These plates are the main element in the manufacture of microprocessors and other electronic components. A competition for the development of a prototype machine was announced on the public procurement website.

According to Vedomosti, according to the terms of reference, the equipment being developed must correspond to functional analogues, such as machines manufactured by Meyer Burger (Switzerland), Linton Kayex (China ) and Diamond Wire Technologies (USA). These devices are designed to cut blanks from silicon and germanium rods up to 300 mm in diameter, as well as blanks from synthetic sapphire, quartz and other materials.

The Ministry of Industry and Trade of the Russian Federation allocated 300 million rubles for the development of equipment for the production of silicon wafers

According to the representative of the Ministry of Industry and Trade, the equipment will be as localized as possible in terms of components and produced in. This Russia is important to ensure the independence of the domestic microelectronic industry, which in recent years has faced sanctions restrictions on the supply of equipment from countries, Europe the United States and. Japan

The representative of the Ministry of Industry and Trade also noted that this type of equipment will be in demand by organizations engaged in the cultivation of single-crystal ingots from semiconductor materials, such as silicon and germanium. Among the possible users of the installation are named enterprises, and NPO Crete "Lassard". "Germanium" In addition, the equipment can be used to work with silicon intended for the production of photocells. solar panels

According to independent expert Aleksei Boyko, the process of creating a silicon wafer begins with growing a single crystal, which is then processed using special equipment. The cutting of blanks, which will later be used for the production of integrated circuits and discrete devices, is an important stage in the chain of creation of microelectronic structures.^[15]

Sanctions did not deprive Russia of access to European and American equipment for the production of electronics, but it went up by 50%

The sanctions did not deprive Russia access to European and American equipment for production, electronic engineers but the cost of this equipment for Russian manufacturers increased by 50%. This rise in price is due to the complication of logistics, the need for disassembly and flashing software in intermediary countries, as well as a change in course. This was reported at the ruble end of August 2024 in. Electronics Developers and Manufacturers Association (ARPE)

According to Vedomosti, despite the sanctions restrictions, Russian companies continue to gain access to advanced technologies from Europe and the United States, which allows them to maintain and develop their production facilities. However, these deliveries have become more expensive and longer. For example, if earlier equipment for mounting components on printed circuit boards or assemblies of end devices could be obtained directly, now this process requires additional steps, which leads to increased costs.

Sanctions did not deprive the Russian Federation of access to European and American equipment for the production of electronics

A representative of one of the domestic manufacturers of electronic components told the publication that the delivery time for such equipment can now reach six months, and its cost has increased by an average of 35-40%. In some cases, prices for equipment, which previously cost ₽100 million, rose to ₽150 - ₽200 million. This is caused not only by sanctions, but also by an increase in the cost of logistics and the disappearance of supplier credit lines.

In addition, the rise in equipment prices directly affects the cost of final products. Whereas assembly costs used to be relatively low, they now add a few percent to the price of the finished product. In a competitive environment, this becomes noticeable to consumers.

Despite all the difficulties, the contract electronics production market in Russia continues to grow. In 2023, its volume reached ₽30,13 billion, which is 40.4% more than in 2022. In the first quarter of 2024, growth was 44% compared to the same period in 2023, the publication said.^[16]

Ministry of Industry and Trade creates landfills for testing equipment for the production of chips

On June 11, 2024, it became known that the Ministry of Industry and Trade of the Russian Federation began to create landfills for testing equipment and materials intended for the production of chips. These sites will be used for testing in the fields of opto- and microwave electronics, power and microelectronics, as well as photographic patterns.

Vasily Shpak, Deputy Minister of Industry and Trade, previously stated the need to create such landfills. According to him, the existing capacities of factories in Moscow, Zelenograd, St. Petersburg and Novosibirsk can be reused and reconstructed for this. The Ministry of Industry and Trade plans cooperation between the state, manufacturers and developers of equipment, factories, as well as the scientific community to organize these specialized sites.

The Ministry of Industry and Trade has begun to create landfills for testing equipment and materials

Various equipment will be tested at the landfills, including photolithographic installations, circuit analyzers and steppers, which are part of the technological routes of microelectronic and microwave electronic industries. According to Arseny Brykin, head of the Basis consortium, these polygons will allow checking the operation of individual line components and developing technical processes.

Russian equipment manufacturers such as Minatech, the Research Institute of Precision Engineering (NIITM) and Semitek can participate in the configuration of these test sites. However, there are no integrated solutions for the production of plates for microcircuits in Russia yet, said independent analyst Aleksei Boyko. It is expected that the first domestic equipment capable of producing chips up to 350 nm in size is already being tested in Zelenograd.

Sergey Kudryashov, partner of Strategy Partners, stressed that the creation of such landfills is critical for the development of the Russian electronics industry. In the context of sanctions and restrictions on the import of equipment from Europe, Japan and South Korea, the development of their own machine tools and equipment becomes a priority.^[17]

2023: Government allocates 100 billion rubles to create equipment for the production of chips

The Russian government allocates 100 billion rubles for the creation of equipment for the production of chips. The Ministry of Industry and Trade told about this in mid-October 2023.

As Kommersant writes with reference to representatives of the department, these funds will be used to carry out development work (ROC) on the development of equipment for the production of micro, SVC, power and optoelectronics, as well as specialized materials. The financing process is planned to be organized by subsidizing work on existing mechanisms of state support, as well as work on public procurement under 44-FZ under the state program "Scientific and Technological Development of the Russian Federation," the Ministry of Industry and Trade specified, without naming the share of budgetary and extrabudgetary sources.

By 2027, following the implementation of the financing program, the authorities expect to receive a full range of domestic equipment for semiconductor production. These will be installations that allow silicon wafers to be manufactured, processed and cut into chips. Also, subsidies will be directed to the development of computer-aided design (CAD) systems. The set of equipment includes photolithographs, ion implantation installations, plasmochemical etching clusters, silicon growth installations. The first domestic photolithographic installation for the production of semiconductors according to 350 nm standards is expected to be obtained in 2024.

The newspaper notes that against the background of investments by global industry players, 100 billion rubles of investments look modest. So, ASML only in 2022 sent €3.25 billion to R&D. Experts interviewed by the publication also noted that the problem is not only in money. The fact is that in Russia there are literally a few specialists capable of engaged in such developments.^[18]

Notes