Semiconductors (Russian market)
Main article: Semiconductors (Russian market)
2024
Creation of the first Russian installation for the production of semiconductor crystals for industrial electronics
Specialists of NIITM JSC, NTC Microelectronics RAS and Soft-Impact LLC developed and tested the first domestic industrial plant for growing gallium nitride crystals on silicon substrates in December 2024. Russia has become the fourth country in the world to master the production of equipment of this class. Read more here
Allocation of ₽1,1 billion for the development of lasers for the production of chips and 3D printing
In early December 2024, the Ministry of Industry and Trade of Russia launched a program to create manufacturing technologies and organize pilot production of materials for Russian lasers necessary for the production of microchips. ₽1,1 billion has been allocated for the implementation of the project, the completion of work is scheduled for December 1, 2026.
According to CNews, the project provides for the development of quantum-sized heteroepitaxial structures based on domestic crystals and substrates of gallium arsenide for diode lasers. The materials being developed are designed for pumping systems of powerful lasers, equipment for laser processing of metals, additive production and medical equipment.
The technology involves the creation of structures using a single crystal substrate of gallium arsenide and layers of solid solutions of semiconductor compounds grown by molecular beam epitaxy based on the In Ga-As and Al-Ga-As system. The project is being implemented within the framework of the state program for the development of the electronic and radio-electronic industry.
Deputy Head of the Ministry of Industry and Trade Vasily Shpak noted that the production of Russian equipment for the production of chips with 350 nm topology will begin in 2024, and with 130 nm topology - in 2026. The development involves the Belarusian Planar and the Zelenograd Nanotechnology Center, which are creating a photolithograph for the manufacture of microcircuits.
The ministry is also working to create equipment for setting up domestic lithographs. "The development of our own production of components is necessary to increase the level of localization of developments and ensure technological independence," the press service of the department emphasized.
As part of the import substitution program, the production of helium-neon lasers and photodetectors for equipment positioning systems used in the production of integrated circuits with topological standards up to 65 nm is being developed and mastered. These kits are planned to be installed in the existing lithographic steppers and scanners Nikon of SF 204-206, i-11, i-12, ASML PAS-5500 series.[1]
Mikhail Mishustin approved a list of equipment for the production of chips, the manufacturers of which will be given benefits from January 1
On December 2, 2024, Prime Minister Mikhail Mishustin approved a list of equipment for creating an electronic component base, the manufacturers of which will receive benefits. We are talking about a reduced premium rate of 7.6%. Read more here.
Allocation of 175 million rubles for the development of helium-neon lasers for the production of chips
On November 22, 2024, the Ministry of Industry and Trade announced a competition for the implementation of development work "Development and development of the production of helium-neon lasers and photodetectors for positioning systems for equipment used in the production of IC (integrated circuits) with topological standards up to 65 nm." 175 million rubles are allocated for the implementation of the project.
The designed equipment includes a helium-neon laser with a power supply unit and cable, as well as a photodetector. These products are designed to replace 5517C model lasers and photodetectors of E1709A models and 10780F manufactured by Keysight in foreign equipment, as well as in existing and developed domestic equipment, such as:
- Lithographic steppers and scanners Nikon of the SF 204-206, i-11, i-12, ASML series PAS-5500 series, as well as image generators of topological structures on photographic patterns;
- Metrological REM for monitoring critical dimensions (CD-SEM) Hitachi series 93xx, CG-4000, CG-5000, as well as optical installations for monitoring the coordinates of topological elements and critical dimensions of structures on photographic patterns;
- Defective control units on AMAT Compass semiconductor plates and topological pattern on photomabels;
- Installation of laser elimination of unacceptable defects on photographic patterns;
- Electron beam lithography units.
The terms of reference states that the design of the created laser and photodetector in terms of overall, installation and connection dimensions should provide interchangeability with similar Keysight products. It is emphasized that the components of the designed devices and materials should be of domestic production and ensure the absence of critical dependence on foreign suppliers.[2]
The Ministry of Industry and Trade allocated ₽1,7 billion to create equipment for the production of silicon wafers
The Ministry of Industry and Trade of Russia announced the allocation of ₽1,7 billion for the development of a chemical-mechanical polishing plant for the production of silicon wafers with a diameter of 200 mm. This became known on November 22, 2024. The equipment is designed for the manufacture of chips with topological norms from 180 to 90 nanometers.
According to CNews, the new installation will become a domestic analogue of the American MIRRA Mesa Integrated System 200 manufactured by Applied Materials. The main consumers of the equipment are the Zelenograd enterprises Micron and NM-TECH.
The expert and author of the Telegram channel RUSmicro Aleksei Boyko notes that the development of a machine for chemical-mechanical polishing is part of a large-scale work to create a complex of domestic production equipment for the production of microcircuits.
The technical requirements provide for the use of exclusively domestic components and materials to ensure independence from foreign manufacturers. The plant will planarize the dielectric layer of silica and then wash the plate and measure the thickness of the layer.
The project is implemented within the framework of the state program of scientific and technological development of Russia. Completion of the development is scheduled for November 30, 2028, and the determination of the performer will take place on December 10, 2024.
This project is part of a comprehensive strategy for the development of electronic engineering in Russia. The ministry also invests in the development of the production of materials for the manufacture of chips and the creation of equipment for setting up domestic lithographs, for which an additional ₽400 million has been allocated. By 2027, it is planned to achieve the production of 100 thousand plates of doped single-crystal silicon.[3]
The Ministry of Industry and Trade allocated ₽0,5 billion for equipment for setting up chip production systems
The Russian Ministry of Industry and Trade initiated in early November 2024 a competitive procedure for the creation of a high-precision measuring complex for calibrating lithographic systems with a budget of ₽497,1 million as part of the national technological development program.
According to CNews, the reference installation being developed will provide control over the characteristics of ultraviolet laser radiation when setting up and operating promising lithographic equipment. Completion of the technical project is scheduled for the second quarter of 2027.
Head of the Department of Electronic Engineering ISTC MIET Yakov Petrenko explained the purpose of the developed complex as a tool for confirming the technical parameters of domestic sources of ultraviolet radiation in lithographic installations.
The technical project covers the development of measuring systems for the analysis of energy indicators and spatial characteristics of radiation at fixed wavelengths of 193 and 248 nanometers. The specification provides for the use of an exclusively domestic component base.
Deputy Minister of Industry and Trade Vasily Shpak announced the start of production of Russian lithographic complexes for the manufacture of microcircuits with topological standards of 350 nanometers in 2024 and 130 nanometers in 2026. Prototypes are tested at the facilities of the Belarusian Planar and the Zelenograd Nanotechnology Center.
Vera Smirnova, Executive Director of the AKRP-Consortium of Design Centers, noted the intensive development of the domestic laser industry. The electronic engineering modernization program includes the creation of fifteen types of specialized measuring equipment.
The priority area is the development of automated production control systems, including complexes for analyzing defects, impurities and accuracy of combining technological layers. Scientific support is carried out by specialized institutes of the Russian Academy of Sciences.[4]
The Ministry of Industry and Trade is preparing 110 projects for the development of equipment for microelectronics for 240 billion rubles
At the end of September 2024, it became known that 110 design works will be implemented in Russia to create installations for the production of microelectronics. The corresponding program was developed by the Ministry of Industry and Trade of the Russian Federation together with the International Scientific and Technological Center (ISTC) MIET.
The newspaper told about the initiative. Sheets Work is planned to be carried out in four areas - process equipment, materials and chemicals, as well as computer-aided design systems (). CAD Budget funding until 2030 will amount to more than 240 billion. rubles As of October 2024, over 50 organizations are participating in the implementation of the program.
In total, it is planned to develop 15 types of instrumentation, 13 types of plasma chemical installations, 10 plants for lithography, nine for housing, eight each for the production of photographic patterns and epitaxy, seven for the manufacture of plates, etc. 20 technological routes have been identified, including microelectronics (from 180 to 28 nm), microwave electronics, photonics, power electronics, production of photographic patterns and assembly of electronic component base (ECB) and modules, production of passive electronics, etc.
According to estimates, by 2030, 70% of equipment and materials for the production of microelectronics will be imported in Russia. In particular, by the end of 2026, it is planned to master the preparation of plates: single crystals will be grown on Russian equipment, cut them, grind and polish, wash and dry, apply elements and control output products. By the same time, it is planned to create lithography with the UV range for the production of processors according to topological standards 350 nm and 130 nm. The development of a unit for electron beam lithography for 150 nm is being prepared. Plus, it is planned to master epitaxy - a process in which several layers of semiconductor materials are grown on one substrate. By 2030, it is expected to release a scanner for the production of chips according to 90-65 nm standards. [5]
Foreign equipment for the production of microelectronics in Russia has risen in price 10 times
Russian manufacturers of power electronics have faced a tenfold increase in prices for imported measuring equipment necessary to control the quality of their products. This became known in September 2024.
According to CNews, Maxim Kharchenko, deputy head of the development department of Voronezh Semiconductor Devices Assembly JSC, announced a significant increase in the cost of foreign analogues of high-precision measuring installations for power electronics. In addition to rising prices, the expert noted difficulties with the supply of such equipment to Russia.
The situation is complicated by the fact that high-accuracy installations for power electronics are not produced in Russia. This equipment is necessary for the output control of good products, including transistors, diodes and power modules.
the author of the Telegram channel Rusmicro Aleksei Boyko confirmed the presence of problems with measurements in the field of power electronics. He explained this by the need for precision measurements against the background of high voltages and currents. The expert also noted that Russian enterprises have to overpay for the purchase of foreign equipment through alternative supply channels.
Despite the current situation, there are companies in Russia that develop and produce measuring equipment. For example, LLC "FORM" produces separate instruments for measurements in power electronics. However, the nomenclature of domestic equipment is significantly inferior to the lines of global or specialized foreign manufacturers.
The problem is exacerbated by outdated standards in the production of power electronics. According to Maxim Kharchenko, the existing system of standards has not been updated for 35-50 years and does not meet modern product requirements.
Despite the difficulties, the production of power electronics is developing in Russia. Element is investing ₽20 billion in the production of power transistors and diodes, planning to provide up to 60% of demand in the country by 2030. In addition, MIET together with NIIET develop nitride-galium technology.[6]
The Ministry of Industry and Trade allocated 500 million rubles for the development of equipment for the production of microelectronics to replace the Chinese
In September 2024 Ministry of Industry and Trade Russia , it allocated almost ₽500 million for the development of equipment for the production of microelectronics, which should replace similar equipment purchased in. We China are talking about the creation of a plant for washing and drying special SMIF containers used to store and move silicon wafers during their production. The equipment is designed to increase the level of purity in the production of semiconductors, which helps to reduce the number of defects and increase the yield of good products.
According to Cnews, the All-Russian Research Institute of Experimental Physics will develop this installation. Two and a half years are allotted for the work. The project provides for the processing of SMIF containers and cassettes for silicon wafers with a diameter of 150 mm and 200 mm. This equipment is in demand at enterprises such as Micron, Istok im. Shokin, NIIS im. Sedakov and NZPP Vostok. According to the Ministry of Industry and Trade, by 2030 the need for such installations in Russia will be at least 10 units.
At the moment, such installations are being purchased in China, which makes their replacement an important part of the import substitution program. The representative of the Ministry of Industry and Trade explained that SMIF containers provide a high level of cleanliness on production lines and help significantly reduce the likelihood of defects when working with semiconductor plates. To maintain this level of cleanliness, special installations are required for cleaning containers that will be produced in Russia using domestic components.
Since the introduction of sanctions against Russia in 2022, the country has been actively working on the development of its own microelectronic industry. In particular, at the end of August 2024, a project was announced to create standards for manufacturers of electronic equipment. In addition, the group, "Item" which through LLC "Nanotronics" is developing equipment for the production of radio, SVC and microelectronics, has already invested several billion rubles in the development of this industry.[7]
The Ministry of Industry and Trade allocated 300 million rubles for the development of equipment for the production of silicon wafers
The Ministry of Industry and Trade of Russia (Ministry of Industry and Trade) in September 2024 announced the allocation of ₽300 million for the development of new equipment intended for the production of silicon wafers. These plates are the main element in the manufacture of microprocessors and other electronic components. A competition for the development of a prototype machine was announced on the public procurement website.
According to Vedomosti, according to the terms of reference, the equipment being developed must correspond to functional analogues, such as machines manufactured by Meyer Burger (Switzerland), Linton Kayex (China ) and Diamond Wire Technologies (USA). These devices are designed to cut blanks from silicon and germanium rods up to 300 mm in diameter, as well as blanks from synthetic sapphire, quartz and other materials.
According to the representative of the Ministry of Industry and Trade, the equipment will be as localized as possible in terms of components and produced in. This Russia is important to ensure the independence of the domestic microelectronic industry, which in recent years has faced sanctions restrictions on the supply of equipment from countries, Europe the United States and. Japan
The representative of the Ministry of Industry and Trade also noted that this type of equipment will be in demand by organizations engaged in the cultivation of single-crystal ingots from semiconductor materials, such as silicon and germanium. Among the possible users of the installation are named enterprises, and NPO Crete "Lassard". "Germanium" In addition, the equipment can be used to work with silicon intended for the production of photocells. solar panels
According to independent expert Aleksei Boyko, the process of creating a silicon wafer begins with growing a single crystal, which is then processed using special equipment. The cutting of blanks, which will later be used for the production of integrated circuits and discrete devices, is an important stage in the chain of creation of microelectronic structures.[8]
Sanctions did not deprive Russia of access to European and American equipment for the production of electronics, but it went up by 50%
The sanctions did not deprive Russia access to European and American equipment for production, electronic engineers but the cost of this equipment for Russian manufacturers increased by 50%. This rise in price is due to the complication of logistics, the need for disassembly and flashing software in intermediary countries, as well as a change in course. This was reported at the ruble end of August 2024 in. Electronics Developers and Manufacturers Association (ARPE)
According to Vedomosti, despite the sanctions restrictions, Russian companies continue to gain access to advanced technologies from Europe and the United States, which allows them to maintain and develop their production facilities. However, these deliveries have become more expensive and longer. For example, if earlier equipment for mounting components on printed circuit boards or assemblies of end devices could be obtained directly, now this process requires additional steps, which leads to increased costs.
A representative of one of the domestic manufacturers of electronic components told the publication that the delivery time for such equipment can now reach six months, and its cost has increased by an average of 35-40%. In some cases, prices for equipment, which previously cost ₽100 million, rose to ₽150 - ₽200 million. This is caused not only by sanctions, but also by an increase in the cost of logistics and the disappearance of supplier credit lines.
In addition, the rise in equipment prices directly affects the cost of final products. Whereas assembly costs used to be relatively low, they now add a few percent to the price of the finished product. In a competitive environment, this becomes noticeable to consumers.
Despite all the difficulties, the contract electronics production market in Russia continues to grow. In 2023, its volume reached ₽30,13 billion, which is 40.4% more than in 2022. In the first quarter of 2024, growth was 44% compared to the same period in 2023, the publication said.[9]
Ministry of Industry and Trade creates landfills for testing equipment for the production of chips
On June 11, 2024, it became known that the Ministry of Industry and Trade of the Russian Federation began to create landfills for testing equipment and materials intended for the production of chips. These sites will be used for testing in the fields of opto- and microwave electronics, power and microelectronics, as well as photographic patterns.
Vasily Shpak, Deputy Minister of Industry and Trade, previously stated the need to create such landfills. According to him, the existing capacities of factories in Moscow, Zelenograd, St. Petersburg and Novosibirsk can be reused and reconstructed for this. The Ministry of Industry and Trade plans cooperation between the state, manufacturers and developers of equipment, factories, as well as the scientific community to organize these specialized sites.
Various equipment will be tested at the landfills, including photolithographic installations, circuit analyzers and steppers, which are part of the technological routes of microelectronic and microwave electronic industries. According to Arseny Brykin, head of the Basis consortium, these polygons will allow checking the operation of individual line components and developing technical processes.
Russian equipment manufacturers such as Minatech, the Research Institute of Precision Engineering (NIITM) and Semitek can participate in the configuration of these test sites. However, there are no integrated solutions for the production of plates for microcircuits in Russia yet, said independent analyst Aleksei Boyko. It is expected that the first domestic equipment capable of producing chips up to 350 nm in size is already being tested in Zelenograd.
Sergey Kudryashov, partner of Strategy Partners, stressed that the creation of such landfills is critical for the development of the Russian electronics industry. In the context of sanctions and restrictions on the import of equipment from Europe, Japan and South Korea, the development of their own machine tools and equipment becomes a priority.[10]
2023: Government allocates 100 billion rubles to create equipment for the production of chips
The Russian government allocates 100 billion rubles for the creation of equipment for the production of chips. The Ministry of Industry and Trade told about this in mid-October 2023.
As Kommersant writes with reference to representatives of the department, these funds will be used to carry out development work (ROC) on the development of equipment for the production of micro, SVC, power and optoelectronics, as well as specialized materials. The financing process is planned to be organized by subsidizing work on existing mechanisms of state support, as well as work on public procurement under 44-FZ under the state program "Scientific and Technological Development of the Russian Federation," the Ministry of Industry and Trade specified, without naming the share of budgetary and extrabudgetary sources.
By 2027, following the implementation of the financing program, the authorities expect to receive a full range of domestic equipment for semiconductor production. These will be installations that allow silicon wafers to be manufactured, processed and cut into chips. Also, subsidies will be directed to the development of computer-aided design (CAD) systems. The set of equipment includes photolithographs, ion implantation installations, plasmochemical etching clusters, silicon growth installations. The first domestic photolithographic installation for the production of semiconductors according to 350 nm standards is expected to be obtained in 2024.
The newspaper notes that against the background of investments by global industry players, 100 billion rubles of investments look modest. So, ASML only in 2022 sent €3.25 billion to R&D. Experts interviewed by the publication also noted that the problem is not only in money. The fact is that in Russia there are literally a few specialists capable of engaged in such developments.[11]
Notes
- ↑ Lasers based on domestic crystals for the production of chips and 3D printing are being created in Russia
- ↑ № 0173100009524000220
- ↑ A plant for the manufacture of silicon wafers to replace the American one is being created in Russia
- ↑ Russia allocated half a billion for equipment for tuning lithographs that produce domestic chips
- ↑ 110 projects for the development of equipment for microelectronics will be launched in Russia
- ↑ In Russia, equipment for microelectronics has risen in price 10 times
- ↑ Rare equipment for the production of microelectronics to replace Chinese is being created in Russia
- ↑ Ministry of Industry and Trade is looking for a developer of equipment for the production of silicon wafers
- ↑ Imported equipment for the production of electronics in Russia has risen in price by 50%
- ↑ The Ministry of Industry and Trade will make landfills for testing equipment for the production of chips
- ↑ Keep the machine wider
| The site content is translated by machine translation software powered by PROMT. The machine-translated articles are not always perfect and may contain errors in vocabulary, syntax or grammar. Read original article If you find inaccuracies or errors in the results of machine translation, please write to editor@tadviser.ru. We will make every effort to correct them as soon as possible. |